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- W4317382968 abstract "Three wet clean processes within conventional BEOL line were evaluated for the hybrid bonding. Global oxide uniformity requirement was found out within hybrid bonding process development. Effects of annealing temperature on the Cu bonding pad and oxide surface were studied. Electrical connection through TSV and hybrid bonding pads was demonstrated." @default.
- W4317382968 created "2023-01-19" @default.
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- W4317382968 date "2022-12-07" @default.
- W4317382968 modified "2023-10-18" @default.
- W4317382968 title "Process Development and Integration for Wafer-to-Wafer Hybrid Bonding" @default.
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- W4317382968 doi "https://doi.org/10.1109/eptc56328.2022.10013123" @default.
- W4317382968 hasPublicationYear "2022" @default.
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