Matches in SemOpenAlex for { <https://semopenalex.org/work/W4317490048> ?p ?o ?g. }
- W4317490048 endingPage "168942" @default.
- W4317490048 startingPage "168942" @default.
- W4317490048 abstract "Eutectic alloys were fabricated from the quaternary Al-Cu-Si-Ni system via arc melting and suction casting. An invariant ternary eutectic reaction (α-Al+Si+θ-Al2(CuNi)) was found in the quaternary alloy system with a composition of Al67.2Cu24Si8Ni0.8 (wt%). The dissolution of Ni (∼1.7 at%) into tetragonal θ-Al2Cu takes place during this ternary eutectic reaction. Density functional theory (DFT) calculations show that the configurational entropy stabilises this level of randomly substituted Ni with Cu sites in the θ-Al2Cu lattice at high temperatures. The as-solidified eutectic microstructure exhibits a lamellar θ-Al2(CuNi) phase showing fragmented lamellar morphology with a lamellar thickness of 130 ± 30 nm and Si exhibits fibrous morphology with a fibre diameter below 100 nm. The thermal stability of the Al-Cu-Si-Ni eutectic alloy after post-solidification annealing was investigated, and the thermal stability of the ternary eutectic microstructure is better than the corresponding Al33Cu (wt%) binary eutectic microstructure. It was found that Ni solution in θ-Al2(CuNi) phase contributes to the thermal stability of this ternary eutectic microstructure and β2-Al3(CuNi)2 (β1-(Cu2.9Ni0.1)Al type, Fm-3 m) phase can transform from θ-Al2(CuNi) phase after annealing at different temperatures. The Al-Cu-Si-Ni eutectic alloy has excellent as-cast hardness together with thermal stability. It is potentially valuable for the design of new aluminium alloys for serving at elevated temperatures." @default.
- W4317490048 created "2023-01-20" @default.
- W4317490048 creator A5008313380 @default.
- W4317490048 creator A5022835555 @default.
- W4317490048 creator A5033726900 @default.
- W4317490048 creator A5051513184 @default.
- W4317490048 creator A5064795527 @default.
- W4317490048 date "2023-04-01" @default.
- W4317490048 modified "2023-09-26" @default.
- W4317490048 title "Thermal behaviour and microstructure evolution of new ternary eutectic alloy in Al-Cu-Si-Ni system" @default.
- W4317490048 cites W1970127494 @default.
- W4317490048 cites W1977240066 @default.
- W4317490048 cites W1979816507 @default.
- W4317490048 cites W1981368803 @default.
- W4317490048 cites W1982572313 @default.
- W4317490048 cites W1985628158 @default.
- W4317490048 cites W1997176888 @default.
- W4317490048 cites W2001773819 @default.
- W4317490048 cites W2006476555 @default.
- W4317490048 cites W2007395042 @default.
- W4317490048 cites W2022488988 @default.
- W4317490048 cites W2024740911 @default.
- W4317490048 cites W2032231720 @default.
- W4317490048 cites W2036113194 @default.
- W4317490048 cites W2057142723 @default.
- W4317490048 cites W2058515440 @default.
- W4317490048 cites W2071296094 @default.
- W4317490048 cites W2095229962 @default.
- W4317490048 cites W2132463326 @default.
- W4317490048 cites W2163272368 @default.
- W4317490048 cites W2195035101 @default.
- W4317490048 cites W2330001018 @default.
- W4317490048 cites W2500349873 @default.
- W4317490048 cites W2891147959 @default.
- W4317490048 cites W2944861738 @default.
- W4317490048 cites W2947746576 @default.
- W4317490048 cites W2965909112 @default.
- W4317490048 cites W2981031062 @default.
- W4317490048 cites W2991461243 @default.
- W4317490048 cites W2995008017 @default.
- W4317490048 cites W3004444160 @default.
- W4317490048 cites W3006170556 @default.
- W4317490048 cites W3087561384 @default.
- W4317490048 cites W3095533431 @default.
- W4317490048 cites W3109937847 @default.
- W4317490048 cites W3111284021 @default.
- W4317490048 cites W3130461577 @default.
- W4317490048 cites W3131531481 @default.
- W4317490048 cites W3134905055 @default.
- W4317490048 cites W3154416604 @default.
- W4317490048 cites W3167527746 @default.
- W4317490048 cites W3183366639 @default.
- W4317490048 cites W3192304218 @default.
- W4317490048 cites W3205883270 @default.
- W4317490048 cites W3208874583 @default.
- W4317490048 cites W3216896388 @default.
- W4317490048 cites W4200176631 @default.
- W4317490048 cites W4200244105 @default.
- W4317490048 cites W4200260110 @default.
- W4317490048 cites W4205390822 @default.
- W4317490048 cites W4210662980 @default.
- W4317490048 cites W4213458074 @default.
- W4317490048 cites W4220763776 @default.
- W4317490048 cites W4229370988 @default.
- W4317490048 cites W4283662685 @default.
- W4317490048 cites W653024690 @default.
- W4317490048 doi "https://doi.org/10.1016/j.jallcom.2023.168942" @default.
- W4317490048 hasPublicationYear "2023" @default.
- W4317490048 type Work @default.
- W4317490048 citedByCount "0" @default.
- W4317490048 crossrefType "journal-article" @default.
- W4317490048 hasAuthorship W4317490048A5008313380 @default.
- W4317490048 hasAuthorship W4317490048A5022835555 @default.
- W4317490048 hasAuthorship W4317490048A5033726900 @default.
- W4317490048 hasAuthorship W4317490048A5051513184 @default.
- W4317490048 hasAuthorship W4317490048A5064795527 @default.
- W4317490048 hasBestOaLocation W43174900481 @default.
- W4317490048 hasConcept C127413603 @default.
- W4317490048 hasConcept C18168003 @default.
- W4317490048 hasConcept C191897082 @default.
- W4317490048 hasConcept C192562407 @default.
- W4317490048 hasConcept C199360897 @default.
- W4317490048 hasConcept C2777855556 @default.
- W4317490048 hasConcept C2780026712 @default.
- W4317490048 hasConcept C37487178 @default.
- W4317490048 hasConcept C41008148 @default.
- W4317490048 hasConcept C42360764 @default.
- W4317490048 hasConcept C59061564 @default.
- W4317490048 hasConcept C64452783 @default.
- W4317490048 hasConcept C77851909 @default.
- W4317490048 hasConcept C87976508 @default.
- W4317490048 hasConceptScore W4317490048C127413603 @default.
- W4317490048 hasConceptScore W4317490048C18168003 @default.
- W4317490048 hasConceptScore W4317490048C191897082 @default.
- W4317490048 hasConceptScore W4317490048C192562407 @default.
- W4317490048 hasConceptScore W4317490048C199360897 @default.
- W4317490048 hasConceptScore W4317490048C2777855556 @default.
- W4317490048 hasConceptScore W4317490048C2780026712 @default.