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- W4319586999 abstract "As the increasingly demand of computer, communication and consumer electronics in recent years, flip-chip ball grid array (FCBGA) with ajinomoto build-up film (ABF) substrate is major package for performance request. But if we consider performance, substrate resource, and cost, alternative package structure is need to replace FCBGA. Hence, two alternative substrates are studied in this paper. Both coreless substrate and fan out chip on substrate (FOCoS) with build-up material apply bismaleimide triazine (BT) material are good candidates. Signal integrity and power integrity comparison between FCBGA and alternative substrates are discussed." @default.
- W4319586999 created "2023-02-09" @default.
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- W4319586999 date "2022-11-09" @default.
- W4319586999 modified "2023-10-01" @default.
- W4319586999 title "A Study on Alternative Substrate for FCBGA" @default.
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- W4319586999 doi "https://doi.org/10.1109/icsj55786.2022.10034688" @default.
- W4319586999 hasPublicationYear "2022" @default.
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