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- W4319662562 endingPage "123946" @default.
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- W4319662562 abstract "A passive cooling material was proposed by combining the advantages of an interpenetrating polymer network and copper powder. The experimental thermal conductivity of copper based composite hydrogel was enhanced to 0.71 W/(m·K). At the same time, MD simulations showed a thermal conductivity of approximately 0.84 W/(m·K), which primarily caused by the increased overlap between hydrogel components. Due to the improvement of the thermal conductivity, the heat flux of copper based composite hydrogel increased to 977 W/m2 at a constant heat source temperature of 65 °C and the total heat dissipation increased by 104.4%. The thermal management tests showed copper based composite hydrogel could reach 35 °C, while the copper based composite hydrogel could reach 50 °C. The obtained copper based PNIPAM/Alginate-Ca2+ hydrogel exhibited a synergistic property enhancement of high thermal conductivity, stability in shape and decreased aggregation of the copper nanoparticles, which should provide a new strategy for thermal management." @default.
- W4319662562 created "2023-02-10" @default.
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- W4319662562 date "2023-06-01" @default.
- W4319662562 modified "2023-10-16" @default.
- W4319662562 title "A thermal management strategy for electronic devices based on copper double skin inspired hydrogel" @default.
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- W4319662562 doi "https://doi.org/10.1016/j.ijheatmasstransfer.2023.123946" @default.
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