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• W4320915278 abstract "Magnetron sputtering generally increases the temperature of the substrate placed to face the sputtering target above 40 °C because the plasmas are transported through unbalanced magnetic field lines from the sputtering target to the substrate surface. However, by using a magnetic mirror-type magnetron cathode, we were able to suppress the temperature of the substrate temperature to the environmental temperature of less than 40 °C at a target–substrate distance of ≥50 mm with a DC input power of ≤30 W and an Ar gas pressure of ≤0.15 Pa. This was possible because the balanced magnetic field lines confined the plasmas near the sputtering target. By enabling film deposition on low heat-resistant substrates, this deposition technique for suppressing the substrate temperature may have uses in various application fields." @default.
• W4320915278 created "2023-02-16" @default.
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• W4320915278 date "2023-02-01" @default.
• W4320915278 modified "2023-09-25" @default.
• W4320915278 title "Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode" @default.
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• W4320915278 doi "https://doi.org/10.1063/5.0138840" @default.
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