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- W4321844105 abstract "Rapid developments in the field of high frequency circuits have led to more aggressive approach in enhancing quality of transmission for signal and power across the system for better performance. Crosstalk remains one of major challenges specially in miniaturized and flexible circuits. Foam provides a low-cost solution for the reduction of the crosstalk. This paper presents a performance comparison of the crosstalk reduction based on simulation and experimental investigations using different types of foam layers to tackle the problem of crosstalk by enhancing the signal and power integrity." @default.
- W4321844105 created "2023-02-25" @default.
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- W4321844105 date "2022-12-12" @default.
- W4321844105 modified "2023-09-28" @default.
- W4321844105 title "Investigations on Crosstalk reduction in high frequency Circuits using commercial foam" @default.
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- W4321844105 doi "https://doi.org/10.1109/mapcon56011.2022.10047306" @default.
- W4321844105 hasPublicationYear "2022" @default.
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