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• W4322774013 endingPage "2298" @default.
• W4322774013 startingPage "2298" @default.
• W4322774013 abstract "In recent years, many efforts are being made to produce tef-based food for its nutritive and health-promoting advantages. Tef grain is always whole milled because of its tiny grain size and whole flours contain bran (pericarp, aleurone, and germ) where major non-starch lipids could be deposited along with the lipid-degrading enzymes: lipase and lipoxygenase. As lipoxygenase shows little activity in low moisture, the inactivation of lipase is the common objective for most heat treatments to extend the shelf life of flours. In this study, tef flour lipase inactivation kinetics via hydrothermal treatments assisted using microwaves (MW) were studied. The effects of tef flour moisture level (12%, 15%, 20%, and 25%) and MW treatment time (1, 2, 4, 6, and 8 min) on flour lipase activity (LA) and free fatty acid (FFA) content were evaluated. The effects of MW treatment on flour pasting characteristics and the rheological properties of gels prepared from the treated flours were also explored. The inactivation process followed a first-order kinetic response and the apparent rate constant of thermal inactivation increased exponentially with the moisture content of the flour (M) according to the equation 0.048·exp (0.073·M) (R2 = 0.97). The LA of the flours decreased up to 90% under the studied conditions. MW treatment also significantly reduced (up to 20%) the FFA level in the flours. The rheological study confirmed the presence of significant modifications induced by the treatment, as a lateral effect of the flour stabilization process." @default.
• W4322774013 created "2023-03-03" @default.
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• W4322774013 date "2023-03-01" @default.
• W4322774013 modified "2023-10-05" @default.
• W4322774013 title "Lipase Inactivation Kinetics of Tef Flour with Microwave Radiation and Impact on the Rheological Properties of the Gels Made from Treated Flour" @default.
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• W4322774013 doi "https://doi.org/10.3390/molecules28052298" @default.
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