Matches in SemOpenAlex for { <https://semopenalex.org/work/W4323047884> ?p ?o ?g. }
Showing items 1 to 84 of
84
with 100 items per page.
- W4323047884 endingPage "1355" @default.
- W4323047884 startingPage "1347" @default.
- W4323047884 abstract "Abstract Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first approach is the change of the roughness of the solder mask to influence the flux spreading around the solder pad. The second approach is the deposition of the same volume of the solder paste to the solder pads using a modified, thicker stencil with smaller apertures. The experiments were performed for solder pastes containing SAC305 alloy and two types of fluxes (ROL0/ROL1). Solder joints were inspected by X-ray imaging, and the shots were subsequently processed by image analysis. For determination of the spreading area of the flux around the solder pad during the reflow process, the tested boards were scanned by a confocal digital microscope. The results showed that more aggressive flux caused less voiding in terms of the average area of voids covering the soldering pad. Analysis of samples prepared with modified stencils showed a much lower proportion of voids than with the standard stencil. Furthermore, the results revealed that the selection of the solder mask type significantly influenced the voids’ formation within solder joints in the case of the unmodified stencil for solder paste deposition. On the other hand, when the modified stencils were used for sample preparation, the solder mask had no further impact on voiding. Therefore, modifying the stencil can be pointed out as a preferable and effective way." @default.
- W4323047884 created "2023-03-04" @default.
- W4323047884 creator A5012499285 @default.
- W4323047884 creator A5030739817 @default.
- W4323047884 creator A5075088260 @default.
- W4323047884 date "2023-03-03" @default.
- W4323047884 modified "2023-10-16" @default.
- W4323047884 title "Analysis of solder mask roughness and stencil shape influence on void formation in solder joints" @default.
- W4323047884 cites W1749304175 @default.
- W4323047884 cites W1975140804 @default.
- W4323047884 cites W1998399034 @default.
- W4323047884 cites W2015815382 @default.
- W4323047884 cites W2046569990 @default.
- W4323047884 cites W2093783967 @default.
- W4323047884 cites W2101041421 @default.
- W4323047884 cites W2115426119 @default.
- W4323047884 cites W2121174993 @default.
- W4323047884 cites W2192785647 @default.
- W4323047884 cites W2241762333 @default.
- W4323047884 cites W2295818416 @default.
- W4323047884 cites W2581150299 @default.
- W4323047884 cites W2799117121 @default.
- W4323047884 cites W2894119087 @default.
- W4323047884 cites W2962863236 @default.
- W4323047884 cites W2970317458 @default.
- W4323047884 cites W3023457189 @default.
- W4323047884 cites W3036426464 @default.
- W4323047884 cites W4286484514 @default.
- W4323047884 cites W4310880983 @default.
- W4323047884 doi "https://doi.org/10.1007/s40194-023-01505-7" @default.
- W4323047884 hasPublicationYear "2023" @default.
- W4323047884 type Work @default.
- W4323047884 citedByCount "1" @default.
- W4323047884 countsByYear W43230478842023 @default.
- W4323047884 crossrefType "journal-article" @default.
- W4323047884 hasAuthorship W4323047884A5012499285 @default.
- W4323047884 hasAuthorship W4323047884A5030739817 @default.
- W4323047884 hasAuthorship W4323047884A5075088260 @default.
- W4323047884 hasBestOaLocation W43230478841 @default.
- W4323047884 hasConcept C159985019 @default.
- W4323047884 hasConcept C191281628 @default.
- W4323047884 hasConcept C191897082 @default.
- W4323047884 hasConcept C192562407 @default.
- W4323047884 hasConcept C2778413121 @default.
- W4323047884 hasConcept C2779772531 @default.
- W4323047884 hasConcept C41008148 @default.
- W4323047884 hasConcept C459310 @default.
- W4323047884 hasConcept C50296614 @default.
- W4323047884 hasConcept C71039073 @default.
- W4323047884 hasConcept C76752949 @default.
- W4323047884 hasConcept C97850793 @default.
- W4323047884 hasConceptScore W4323047884C159985019 @default.
- W4323047884 hasConceptScore W4323047884C191281628 @default.
- W4323047884 hasConceptScore W4323047884C191897082 @default.
- W4323047884 hasConceptScore W4323047884C192562407 @default.
- W4323047884 hasConceptScore W4323047884C2778413121 @default.
- W4323047884 hasConceptScore W4323047884C2779772531 @default.
- W4323047884 hasConceptScore W4323047884C41008148 @default.
- W4323047884 hasConceptScore W4323047884C459310 @default.
- W4323047884 hasConceptScore W4323047884C50296614 @default.
- W4323047884 hasConceptScore W4323047884C71039073 @default.
- W4323047884 hasConceptScore W4323047884C76752949 @default.
- W4323047884 hasConceptScore W4323047884C97850793 @default.
- W4323047884 hasFunder F4320309972 @default.
- W4323047884 hasIssue "5" @default.
- W4323047884 hasLocation W43230478841 @default.
- W4323047884 hasOpenAccess W4323047884 @default.
- W4323047884 hasPrimaryLocation W43230478841 @default.
- W4323047884 hasRelatedWork W1508560959 @default.
- W4323047884 hasRelatedWork W2006747861 @default.
- W4323047884 hasRelatedWork W2125728782 @default.
- W4323047884 hasRelatedWork W2166914931 @default.
- W4323047884 hasRelatedWork W2335455306 @default.
- W4323047884 hasRelatedWork W2370046691 @default.
- W4323047884 hasRelatedWork W2379397317 @default.
- W4323047884 hasRelatedWork W3133430801 @default.
- W4323047884 hasRelatedWork W4225293789 @default.
- W4323047884 hasRelatedWork W2885755288 @default.
- W4323047884 hasVolume "67" @default.
- W4323047884 isParatext "false" @default.
- W4323047884 isRetracted "false" @default.
- W4323047884 workType "article" @default.