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- W4323848819 abstract "A methodology to estimate the device temperature in resistive random access memories (RRAMs) is presented. Unipolar devices, which are known to be highly influenced by thermal effects in their resistive switching operation, are employed to develop the technique. A 3D RRAM simulator is used to fit experimental data and obtain the maximum and average temperatures of the conductive filaments (CFs) that are responsible for the switching behavior. It is found that the experimental CFs temperature corresponds to the maximum simulated temperatures obtained at the narrowest sections of the CFs. These temperature values can be used to improve compact models for circuit simulation purposes." @default.
- W4323848819 created "2023-03-11" @default.
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- W4323848819 date "2023-03-10" @default.
- W4323848819 modified "2023-09-28" @default.
- W4323848819 title "Thermal Characterization of Conductive Filaments in Unipolar Resistive Memories" @default.
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- W4323848819 doi "https://doi.org/10.3390/mi14030630" @default.
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