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- W4361279413 abstract "Due to the increase of board thickness and the decrease of hole diameter (aspect ratio greater than 20), the high-frequency high-speed printed circuit board (HFHSPCB) required for 5G/6G communications brings new challenges to micro-hole drilling process. In this paper, the failure mode and failure mechanism of HFHSPBC large aspect ratio micro-hole drilling process (0.2 mm diameter micro-hole and 4.14 mm thickness HFHSPCB) were studied. Experimental results showed that micro-drill fracture was the main failure mode of the process, while observations of the micro-drill cutting edge and the fractured micro-drill surface suggested that the cause of fracture was not tool wear. Further analysis of thrust force and torque during drilling revealed that, the micro-drill fracture was not due to excessive thrust force as known for traditional PCB drilling, but excessive torque caused by friction and chip removal resistance during drilling. Micro-drill fracture occurred only in the speed conversion stage where material removal was zero but drilling torque was the maximum. Based on the micro-drill fracture analysis, a non-equal-step peck drilling process was proposed to control the drilling torque below the limit value. Compared to direct drilling or equal-step peck drilling, this non-equal-step peck drilling method greatly prolonged micro-drill life, realized near-zero micro-drill fracture, and largely enhanced micro-hole quality." @default.
- W4361279413 created "2023-03-31" @default.
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- W4361279413 date "2023-07-01" @default.
- W4361279413 modified "2023-09-23" @default.
- W4361279413 title "Mechanism investigation of micro-drill fracture in PCB large aspect ratio micro-hole drilling" @default.
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- W4361279413 doi "https://doi.org/10.1016/j.jmatprotec.2023.117962" @default.
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