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• W4362634340 endingPage "112890" @default.
• W4362634340 startingPage "112890" @default.
• W4362634340 abstract "We reported a phenomenon and mechanism of recrystallization evolution in solder joint under thermo-mechanical stress. Ball Grid Array samples fabricated by Sn3.0Ag0.5Cu solder were placed into the thermal cycling test chamber with a temperature range of −55 °C to 125 °C. Characterized using electron backscattered diffraction technique, three stages of recrystallization occurring in the solder joint were found to co-exist in one joint after 2500 thermal cycles. To better understand the formation of recrystallized grains during thermal cycling, especially dislocation substructures at the early stage, thin foils corresponding to different stages of the recrystallization were extracted by focus ion beam from the solder joint and analyzed by high-resolution transmission electron microscope. We summarize the recrystallization process including the annihilation of dislocation dipoles contributes to the evolution of sub-grain boundaries, and then the recrystallized grains are generated by sub-grain rotation mechanism. In addition, the recrystallized grains proceed to the subsequent same cycle until the failure of solder joint. The study provides the theoretical basis and technical support for further improving the thermo-mechanical reliability of Sn-based lead-free solder joints." @default.
• W4362634340 created "2023-04-07" @default.
• W4362634340 creator A5002675998 @default.
• W4362634340 creator A5008228088 @default.
• W4362634340 creator A5020447652 @default.
• W4362634340 creator A5068671224 @default.
• W4362634340 creator A5083698702 @default.
• W4362634340 creator A5087089173 @default.
• W4362634340 date "2023-06-01" @default.
• W4362634340 modified "2023-10-06" @default.
• W4362634340 title "TEM and EBSD characterization revealing the recrystallization process occurring in the Sn-3.0Ag-0.5Cu Ball Grid Array solder joints during thermal cycling" @default.
• W4362634340 cites W1973105765 @default.
• W4362634340 cites W1976365701 @default.
• W4362634340 cites W1977666693 @default.
• W4362634340 cites W1978522925 @default.
• W4362634340 cites W1982027749 @default.
• W4362634340 cites W2000394791 @default.
• W4362634340 cites W2016280732 @default.
• W4362634340 cites W2018538306 @default.
• W4362634340 cites W2029515162 @default.
• W4362634340 cites W2076838552 @default.
• W4362634340 cites W2398830242 @default.
• W4362634340 cites W2513613747 @default.
• W4362634340 cites W2548187202 @default.
• W4362634340 cites W2561154987 @default.
• W4362634340 cites W2587458171 @default.
• W4362634340 cites W2596319628 @default.
• W4362634340 cites W2766379265 @default.
• W4362634340 cites W2789137498 @default.
• W4362634340 cites W2791809622 @default.
• W4362634340 cites W2898031050 @default.
• W4362634340 cites W2917537872 @default.
• W4362634340 cites W2969387063 @default.
• W4362634340 cites W3022722432 @default.
• W4362634340 cites W3108965145 @default.
• W4362634340 cites W4214808580 @default.
• W4362634340 cites W4221009105 @default.
• W4362634340 cites W4248759012 @default.
• W4362634340 cites W792391428 @default.
• W4362634340 doi "https://doi.org/10.1016/j.matchar.2023.112890" @default.
• W4362634340 hasPublicationYear "2023" @default.
• W4362634340 type Work @default.
• W4362634340 citedByCount "0" @default.
• W4362634340 crossrefType "journal-article" @default.
• W4362634340 hasAuthorship W4362634340A5002675998 @default.
• W4362634340 hasAuthorship W4362634340A5008228088 @default.
• W4362634340 hasAuthorship W4362634340A5020447652 @default.
• W4362634340 hasAuthorship W4362634340A5068671224 @default.
• W4362634340 hasAuthorship W4362634340A5083698702 @default.
• W4362634340 hasAuthorship W4362634340A5087089173 @default.
• W4362634340 hasConcept C121332964 @default.
• W4362634340 hasConcept C151730666 @default.
• W4362634340 hasConcept C153294291 @default.
• W4362634340 hasConcept C159985019 @default.
• W4362634340 hasConcept C169010117 @default.
• W4362634340 hasConcept C172658604 @default.
• W4362634340 hasConcept C177564732 @default.
• W4362634340 hasConcept C191897082 @default.
• W4362634340 hasConcept C192562407 @default.
• W4362634340 hasConcept C195702682 @default.
• W4362634340 hasConcept C204530211 @default.
• W4362634340 hasConcept C27805521 @default.
• W4362634340 hasConcept C50296614 @default.
• W4362634340 hasConcept C86803240 @default.
• W4362634340 hasConcept C87976508 @default.
• W4362634340 hasConcept C94709252 @default.
• W4362634340 hasConceptScore W4362634340C121332964 @default.
• W4362634340 hasConceptScore W4362634340C151730666 @default.
• W4362634340 hasConceptScore W4362634340C153294291 @default.
• W4362634340 hasConceptScore W4362634340C159985019 @default.
• W4362634340 hasConceptScore W4362634340C169010117 @default.
• W4362634340 hasConceptScore W4362634340C172658604 @default.
• W4362634340 hasConceptScore W4362634340C177564732 @default.
• W4362634340 hasConceptScore W4362634340C191897082 @default.
• W4362634340 hasConceptScore W4362634340C192562407 @default.
• W4362634340 hasConceptScore W4362634340C195702682 @default.
• W4362634340 hasConceptScore W4362634340C204530211 @default.
• W4362634340 hasConceptScore W4362634340C27805521 @default.
• W4362634340 hasConceptScore W4362634340C50296614 @default.
• W4362634340 hasConceptScore W4362634340C86803240 @default.
• W4362634340 hasConceptScore W4362634340C87976508 @default.
• W4362634340 hasConceptScore W4362634340C94709252 @default.
• W4362634340 hasFunder F4320321001 @default.
• W4362634340 hasFunder F4320323068 @default.
• W4362634340 hasFunder F4320335443 @default.
• W4362634340 hasLocation W43626343401 @default.
• W4362634340 hasOpenAccess W4362634340 @default.
• W4362634340 hasPrimaryLocation W43626343401 @default.
• W4362634340 hasRelatedWork W1991784759 @default.
• W4362634340 hasRelatedWork W2020966414 @default.
• W4362634340 hasRelatedWork W2577911356 @default.
• W4362634340 hasRelatedWork W2797508597 @default.
• W4362634340 hasRelatedWork W2895156086 @default.
• W4362634340 hasRelatedWork W2914200759 @default.
• W4362634340 hasRelatedWork W3201150739 @default.
• W4362634340 hasRelatedWork W4280557141 @default.
• W4362634340 hasRelatedWork W4322624818 @default.
• W4362634340 hasRelatedWork W4362634340 @default.

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