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- W4365510954 abstract "Abstract This paper proposes a method for enhancing the adhesion strength between parylene C and the substrate by depositing a layer of Al 2 O 3 film with residual tensile stress on parylene C by atomic layer deposition. Compared with pretreatment using a coupling agent, it improves the adhesion strength by 2.4 times. The parylene C/Al 2 O 3 hybrid film maintains a good barrier performance after 10 000 times of bending with a bending radius of 3 mm, with the water vapor transmission rate (WVTR) retained at 3.55 × 10 −4 g·m −2 ·d −1 . Encapsulation of flexible organic light-emitting diodes is carried out using this hybrid film without a negative effect on the performance." @default.
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- W4365510954 date "2023-04-01" @default.
- W4365510954 modified "2023-10-16" @default.
- W4365510954 title "Modulating residual stress based on atomic layer deposition to enhance the adhesion of parylene C for encapsulation of flexible organic light-emitting diodes" @default.
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- W4365510954 doi "https://doi.org/10.35848/1882-0786/acc781" @default.
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