Matches in SemOpenAlex for { <https://semopenalex.org/work/W4366089500> ?p ?o ?g. }
- W4366089500 abstract "Abstract Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties. Indeed, conventional fabrication processes, typically based on photolithography, involve solvents and acids that might harm fragile or exotic substrates. In this context, transfer techniques define a route to overcome the issues related to the nature of the substrate by using supportive carriers in the electronics stack that mitigate or avoid any damages during the fabrication process. Here, a substrate‐free approach is presented for the transfer of ultra‐thin electronics (<150nm‐thick) where no additional layer besides the electronics one remains on the final substrate. Devices are transferred on several surfaces showing good adhesion and an average performance variation of 27%. Furthermore, a sensor bent to a radius of 15.25µm, shows variation in performance of 5%. The technique can also be sequentially repeated for the fabrication of stacked electronics, enabling the development of ultra‐thin devices, compliant on unconventional surfaces." @default.
- W4366089500 created "2023-04-19" @default.
- W4366089500 creator A5006637972 @default.
- W4366089500 creator A5017647320 @default.
- W4366089500 creator A5028256613 @default.
- W4366089500 creator A5029376300 @default.
- W4366089500 creator A5031614487 @default.
- W4366089500 creator A5073878733 @default.
- W4366089500 date "2023-04-17" @default.
- W4366089500 modified "2023-10-18" @default.
- W4366089500 title "Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics" @default.
- W4366089500 cites W1998444838 @default.
- W4366089500 cites W2000670178 @default.
- W4366089500 cites W2024369960 @default.
- W4366089500 cites W2035559809 @default.
- W4366089500 cites W2044815207 @default.
- W4366089500 cites W2062808336 @default.
- W4366089500 cites W2088301533 @default.
- W4366089500 cites W2104155957 @default.
- W4366089500 cites W2134296725 @default.
- W4366089500 cites W2149856173 @default.
- W4366089500 cites W2172279702 @default.
- W4366089500 cites W2203419770 @default.
- W4366089500 cites W2330159636 @default.
- W4366089500 cites W2333651890 @default.
- W4366089500 cites W2566042081 @default.
- W4366089500 cites W2744216549 @default.
- W4366089500 cites W2754486364 @default.
- W4366089500 cites W2768749805 @default.
- W4366089500 cites W2781743800 @default.
- W4366089500 cites W2799754665 @default.
- W4366089500 cites W2806788285 @default.
- W4366089500 cites W2886878416 @default.
- W4366089500 cites W2888405817 @default.
- W4366089500 cites W2890190664 @default.
- W4366089500 cites W2892269414 @default.
- W4366089500 cites W2911687781 @default.
- W4366089500 cites W2921507633 @default.
- W4366089500 cites W2966018205 @default.
- W4366089500 cites W2982474309 @default.
- W4366089500 cites W3000464971 @default.
- W4366089500 cites W3003810553 @default.
- W4366089500 cites W3041710648 @default.
- W4366089500 cites W3105982350 @default.
- W4366089500 cites W3116224733 @default.
- W4366089500 cites W3120764618 @default.
- W4366089500 cites W3165223100 @default.
- W4366089500 cites W4225003976 @default.
- W4366089500 cites W4288064553 @default.
- W4366089500 doi "https://doi.org/10.1002/aelm.202201281" @default.
- W4366089500 hasPublicationYear "2023" @default.
- W4366089500 type Work @default.
- W4366089500 citedByCount "0" @default.
- W4366089500 crossrefType "journal-article" @default.
- W4366089500 hasAuthorship W4366089500A5006637972 @default.
- W4366089500 hasAuthorship W4366089500A5017647320 @default.
- W4366089500 hasAuthorship W4366089500A5028256613 @default.
- W4366089500 hasAuthorship W4366089500A5029376300 @default.
- W4366089500 hasAuthorship W4366089500A5031614487 @default.
- W4366089500 hasAuthorship W4366089500A5073878733 @default.
- W4366089500 hasBestOaLocation W43660895001 @default.
- W4366089500 hasConcept C105487726 @default.
- W4366089500 hasConcept C111368507 @default.
- W4366089500 hasConcept C119599485 @default.
- W4366089500 hasConcept C127313418 @default.
- W4366089500 hasConcept C127413603 @default.
- W4366089500 hasConcept C136525101 @default.
- W4366089500 hasConcept C138331895 @default.
- W4366089500 hasConcept C142724271 @default.
- W4366089500 hasConcept C151730666 @default.
- W4366089500 hasConcept C171250308 @default.
- W4366089500 hasConcept C192562407 @default.
- W4366089500 hasConcept C204787440 @default.
- W4366089500 hasConcept C2777289219 @default.
- W4366089500 hasConcept C2779227376 @default.
- W4366089500 hasConcept C2779343474 @default.
- W4366089500 hasConcept C49040817 @default.
- W4366089500 hasConcept C71924100 @default.
- W4366089500 hasConcept C84967400 @default.
- W4366089500 hasConcept C86803240 @default.
- W4366089500 hasConceptScore W4366089500C105487726 @default.
- W4366089500 hasConceptScore W4366089500C111368507 @default.
- W4366089500 hasConceptScore W4366089500C119599485 @default.
- W4366089500 hasConceptScore W4366089500C127313418 @default.
- W4366089500 hasConceptScore W4366089500C127413603 @default.
- W4366089500 hasConceptScore W4366089500C136525101 @default.
- W4366089500 hasConceptScore W4366089500C138331895 @default.
- W4366089500 hasConceptScore W4366089500C142724271 @default.
- W4366089500 hasConceptScore W4366089500C151730666 @default.
- W4366089500 hasConceptScore W4366089500C171250308 @default.
- W4366089500 hasConceptScore W4366089500C192562407 @default.
- W4366089500 hasConceptScore W4366089500C204787440 @default.
- W4366089500 hasConceptScore W4366089500C2777289219 @default.
- W4366089500 hasConceptScore W4366089500C2779227376 @default.
- W4366089500 hasConceptScore W4366089500C2779343474 @default.
- W4366089500 hasConceptScore W4366089500C49040817 @default.
- W4366089500 hasConceptScore W4366089500C71924100 @default.
- W4366089500 hasConceptScore W4366089500C84967400 @default.
- W4366089500 hasConceptScore W4366089500C86803240 @default.
- W4366089500 hasIssue "9" @default.