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- W4366140003 abstract "Electronics in harsh environments may be subjected to high sustained temperatures and wide temperature extremes in the presence of high strain rates of shock and vibration in the range of $1-100sec^{-1}$. Earlier work on SnAgCu Alloys has shown the detrimental effects of sustained high-temperature exposure on mechanical properties, including elastic modulus, ultimate tensile strength, and percentage elongation at low strain rates. The industry has experimented with the addition of dopants to mitigate property degradation, including Bismuth and Nickel. The constitutive models for a number of emerging alloys are not available for assessment of accrued damage in shock and vibration. In this paper, SAC-Q, SAC-R, and M758 alloys have been studied for the effect of sustained high temperature for up to 1-year, and high strain rates imposed at wide temperatures extremes of −65°C to +200°C. Material properties have been measured in a strain range of $1-100sec^{-1}$. Anand parameters have been computed for various aging durations. The accuracy of the Anand Model Parameters has been quantified by comparison of the model predictions with the experimentally measured data. A predictive framework based on plastic work per cycle has been developed for the assessment of accrued damage in mechanical shock and vibration." @default.
- W4366140003 created "2023-04-19" @default.
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- W4366140003 date "2023-04-17" @default.
- W4366140003 modified "2023-10-18" @default.
- W4366140003 title "Undoped and Doped Solder Performance under High Strain Rates and Wide Operating Temperatures after Prolonged Storage" @default.
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- W4366140003 doi "https://doi.org/10.1109/eurosime56861.2023.10100788" @default.
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