Matches in SemOpenAlex for { <https://semopenalex.org/work/W4366146986> ?p ?o ?g. }
Showing items 1 to 77 of
77
with 100 items per page.
- W4366146986 abstract "This work explored the gold stud bump-based flip-chip metal-to-metal bonding for high-temperature (600°C) SiC IC integration and packaging. Gold stud bumps were created onto the dummy SiC chips using a standard wire bonder with one mil gold wires. Different substrate metal conductor materials, including electroplated gold, screen-printed gold, and sputtered thin-film gold, were used. The dummy chips with gold stud bumps were flip-chip bonded to the various substrates and subjected to a thermal aging process at 600°C for 2, 4, and 6 days. Die shear test was used to test the bonding reliability after days of the thermal aging process, which shows that the electroplated gold has the best bonding reliability for long-term high temperatures applications such as Venus surface explorations. 1 μm thick platinum conductors on the SiC host substrate warped and detached from the titanium adhesion layer after days of thermal aging, indicating that the platinum film must be thinner to service long-term high-temperature application purposes." @default.
- W4366146986 created "2023-04-19" @default.
- W4366146986 creator A5081215027 @default.
- W4366146986 creator A5081844561 @default.
- W4366146986 date "2023-03-01" @default.
- W4366146986 modified "2023-09-25" @default.
- W4366146986 title "Metal-to-Metal Flip-Chip Bonding for High-Temperature 3D SiC IC Integration and Packaging" @default.
- W4366146986 cites W2804173014 @default.
- W4366146986 cites W3173520437 @default.
- W4366146986 cites W3175250547 @default.
- W4366146986 cites W4285103030 @default.
- W4366146986 cites W4309421286 @default.
- W4366146986 doi "https://doi.org/10.1109/wmed58543.2023.10097447" @default.
- W4366146986 hasPublicationYear "2023" @default.
- W4366146986 type Work @default.
- W4366146986 citedByCount "0" @default.
- W4366146986 crossrefType "proceedings-article" @default.
- W4366146986 hasAuthorship W4366146986A5081215027 @default.
- W4366146986 hasAuthorship W4366146986A5081844561 @default.
- W4366146986 hasConcept C111106434 @default.
- W4366146986 hasConcept C111368507 @default.
- W4366146986 hasConcept C119599485 @default.
- W4366146986 hasConcept C121332964 @default.
- W4366146986 hasConcept C127313418 @default.
- W4366146986 hasConcept C127413603 @default.
- W4366146986 hasConcept C140269135 @default.
- W4366146986 hasConcept C153294291 @default.
- W4366146986 hasConcept C159985019 @default.
- W4366146986 hasConcept C165005293 @default.
- W4366146986 hasConcept C171250308 @default.
- W4366146986 hasConcept C177564732 @default.
- W4366146986 hasConcept C191897082 @default.
- W4366146986 hasConcept C192562407 @default.
- W4366146986 hasConcept C204530211 @default.
- W4366146986 hasConcept C2777289219 @default.
- W4366146986 hasConcept C2779227376 @default.
- W4366146986 hasConcept C49040817 @default.
- W4366146986 hasConcept C51807945 @default.
- W4366146986 hasConcept C68928338 @default.
- W4366146986 hasConcept C79072407 @default.
- W4366146986 hasConceptScore W4366146986C111106434 @default.
- W4366146986 hasConceptScore W4366146986C111368507 @default.
- W4366146986 hasConceptScore W4366146986C119599485 @default.
- W4366146986 hasConceptScore W4366146986C121332964 @default.
- W4366146986 hasConceptScore W4366146986C127313418 @default.
- W4366146986 hasConceptScore W4366146986C127413603 @default.
- W4366146986 hasConceptScore W4366146986C140269135 @default.
- W4366146986 hasConceptScore W4366146986C153294291 @default.
- W4366146986 hasConceptScore W4366146986C159985019 @default.
- W4366146986 hasConceptScore W4366146986C165005293 @default.
- W4366146986 hasConceptScore W4366146986C171250308 @default.
- W4366146986 hasConceptScore W4366146986C177564732 @default.
- W4366146986 hasConceptScore W4366146986C191897082 @default.
- W4366146986 hasConceptScore W4366146986C192562407 @default.
- W4366146986 hasConceptScore W4366146986C204530211 @default.
- W4366146986 hasConceptScore W4366146986C2777289219 @default.
- W4366146986 hasConceptScore W4366146986C2779227376 @default.
- W4366146986 hasConceptScore W4366146986C49040817 @default.
- W4366146986 hasConceptScore W4366146986C51807945 @default.
- W4366146986 hasConceptScore W4366146986C68928338 @default.
- W4366146986 hasConceptScore W4366146986C79072407 @default.
- W4366146986 hasLocation W43661469861 @default.
- W4366146986 hasOpenAccess W4366146986 @default.
- W4366146986 hasPrimaryLocation W43661469861 @default.
- W4366146986 hasRelatedWork W138394269 @default.
- W4366146986 hasRelatedWork W1963684115 @default.
- W4366146986 hasRelatedWork W2062276134 @default.
- W4366146986 hasRelatedWork W2086245558 @default.
- W4366146986 hasRelatedWork W2130847291 @default.
- W4366146986 hasRelatedWork W2269824052 @default.
- W4366146986 hasRelatedWork W2366970374 @default.
- W4366146986 hasRelatedWork W2537628077 @default.
- W4366146986 hasRelatedWork W4232026772 @default.
- W4366146986 hasRelatedWork W1533409297 @default.
- W4366146986 isParatext "false" @default.
- W4366146986 isRetracted "false" @default.
- W4366146986 workType "article" @default.