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- W4366177551 abstract "This is a review of a new class of fundamental results concerning the optimal spacing of parallel heat generating boards arranged in a stack of fixed volume. The cooling is by single-phase laminar flow, in natural convection or forced convection. Several board models will be considered: smooth boards with uniform temperature or uniform heat flux, flush mounted heat sources, protruding heat sources, and a board cooled in its own (insulated) parallel plate channel." @default.
- W4366177551 created "2023-04-19" @default.
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- W4366177551 date "2023-01-01" @default.
- W4366177551 modified "2023-09-30" @default.
- W4366177551 title "OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES" @default.
- W4366177551 doi "https://doi.org/10.1615/istp-vi.40" @default.
- W4366177551 hasPublicationYear "2023" @default.
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