Matches in SemOpenAlex for { <https://semopenalex.org/work/W4366773469> ?p ?o ?g. }
- W4366773469 endingPage "802" @default.
- W4366773469 startingPage "802" @default.
- W4366773469 abstract "Metal/carbon composite plating is an effective strategy for improving and adding properties to metal plating by incorporating carbon materials into the metal matrices. Copper (Cu) is widely applied, particularly in the areas of heat management and electronic packaging owing to its high thermal and electrical conductivities, which can be further improved together with improvements in mechanical properties by compositing it with carbon nanotubes (CNTs). However, because hydrophobic CNTs are hardly dispersible in aqueous solutions, additional intense acid treatment or the addition of dispersants is required for their dispersion. Moreover, previous studies have reported that these methods suffer from deterioration of composite material performance through the destruction of the CNT surface or the inclusion of dispersants into the plating. Therefore, in this study, the electrodeposition of a Cu/CNT composite in a non-aqueous solvent that can disperse CNTs without any additional treatment is investigated. The experimental results show that it is possible to deposit Cu from a N-methyl-2-pyrrolidone containing copper iodide and potassium iodide. Furthermore, Cu/CNT composite platings containing CNTs up to 0.12 mass% were prepared by constant current electrolysis, and applying pulse electrolysis can increase the CNTs content up to 0.22 mass%." @default.
- W4366773469 created "2023-04-25" @default.
- W4366773469 creator A5000646413 @default.
- W4366773469 creator A5040216799 @default.
- W4366773469 creator A5044323945 @default.
- W4366773469 creator A5055129652 @default.
- W4366773469 creator A5076609574 @default.
- W4366773469 creator A5078395033 @default.
- W4366773469 creator A5082295322 @default.
- W4366773469 date "2023-04-20" @default.
- W4366773469 modified "2023-10-14" @default.
- W4366773469 title "Preliminary Study on Electrodeposition of Copper Platings and Codeposition of Carbon Nanotubes from Organic Solvent" @default.
- W4366773469 cites W1985431957 @default.
- W4366773469 cites W2001629687 @default.
- W4366773469 cites W2001873598 @default.
- W4366773469 cites W2051037154 @default.
- W4366773469 cites W2051139296 @default.
- W4366773469 cites W2065369911 @default.
- W4366773469 cites W2069167811 @default.
- W4366773469 cites W2085532135 @default.
- W4366773469 cites W2090143236 @default.
- W4366773469 cites W2110261186 @default.
- W4366773469 cites W2136859082 @default.
- W4366773469 cites W2272530067 @default.
- W4366773469 cites W2474508382 @default.
- W4366773469 cites W2612512961 @default.
- W4366773469 cites W2619483523 @default.
- W4366773469 cites W2760322364 @default.
- W4366773469 cites W2772879771 @default.
- W4366773469 cites W2830745970 @default.
- W4366773469 cites W2886835832 @default.
- W4366773469 cites W2892184671 @default.
- W4366773469 cites W2901922947 @default.
- W4366773469 cites W2914947693 @default.
- W4366773469 cites W2917227389 @default.
- W4366773469 cites W2921104352 @default.
- W4366773469 cites W2946955946 @default.
- W4366773469 cites W2951888366 @default.
- W4366773469 cites W2962112200 @default.
- W4366773469 cites W2984077307 @default.
- W4366773469 cites W2999287252 @default.
- W4366773469 cites W3008898507 @default.
- W4366773469 cites W3036729878 @default.
- W4366773469 cites W3038522014 @default.
- W4366773469 cites W3045363972 @default.
- W4366773469 cites W3080823829 @default.
- W4366773469 cites W3088681605 @default.
- W4366773469 cites W3092536601 @default.
- W4366773469 cites W3096836572 @default.
- W4366773469 cites W3103001902 @default.
- W4366773469 cites W3126813235 @default.
- W4366773469 cites W3163291555 @default.
- W4366773469 cites W3166582632 @default.
- W4366773469 cites W3207716971 @default.
- W4366773469 cites W4241946478 @default.
- W4366773469 cites W4306149419 @default.
- W4366773469 cites W4313705083 @default.
- W4366773469 doi "https://doi.org/10.3390/coatings13040802" @default.
- W4366773469 hasPublicationYear "2023" @default.
- W4366773469 type Work @default.
- W4366773469 citedByCount "0" @default.
- W4366773469 crossrefType "journal-article" @default.
- W4366773469 hasAuthorship W4366773469A5000646413 @default.
- W4366773469 hasAuthorship W4366773469A5040216799 @default.
- W4366773469 hasAuthorship W4366773469A5044323945 @default.
- W4366773469 hasAuthorship W4366773469A5055129652 @default.
- W4366773469 hasAuthorship W4366773469A5076609574 @default.
- W4366773469 hasAuthorship W4366773469A5078395033 @default.
- W4366773469 hasAuthorship W4366773469A5082295322 @default.
- W4366773469 hasBestOaLocation W43667734691 @default.
- W4366773469 hasConcept C104779481 @default.
- W4366773469 hasConcept C120665830 @default.
- W4366773469 hasConcept C121332964 @default.
- W4366773469 hasConcept C127313418 @default.
- W4366773469 hasConcept C127413603 @default.
- W4366773469 hasConcept C145889102 @default.
- W4366773469 hasConcept C147789679 @default.
- W4366773469 hasConcept C159985019 @default.
- W4366773469 hasConcept C163127949 @default.
- W4366773469 hasConcept C17525397 @default.
- W4366773469 hasConcept C177562468 @default.
- W4366773469 hasConcept C178790620 @default.
- W4366773469 hasConcept C184651966 @default.
- W4366773469 hasConcept C185592680 @default.
- W4366773469 hasConcept C191897082 @default.
- W4366773469 hasConcept C192562407 @default.
- W4366773469 hasConcept C2776985018 @default.
- W4366773469 hasConcept C42360764 @default.
- W4366773469 hasConcept C513720949 @default.
- W4366773469 hasConcept C544778455 @default.
- W4366773469 hasConcept C68801617 @default.
- W4366773469 hasConcept C8058405 @default.
- W4366773469 hasConceptScore W4366773469C104779481 @default.
- W4366773469 hasConceptScore W4366773469C120665830 @default.
- W4366773469 hasConceptScore W4366773469C121332964 @default.
- W4366773469 hasConceptScore W4366773469C127313418 @default.
- W4366773469 hasConceptScore W4366773469C127413603 @default.
- W4366773469 hasConceptScore W4366773469C145889102 @default.