Matches in SemOpenAlex for { <https://semopenalex.org/work/W4366966532> ?p ?o ?g. }
- W4366966532 endingPage "559" @default.
- W4366966532 startingPage "553" @default.
- W4366966532 abstract "Thermocompression ultrasonic flip bonding has been widely used in semiconductor packaging. In order to better understand the mechanism of bonding interface formation of thermocompression ultrasonic flip bonding. A 3-D dynamics finite element model (FEM) of the chip, gold bumps, and substrate was developed, which considers the softening effect of gold bumps during the bonding process. The effects of pressure application position, pressure magnitude, temperature, and ultrasonic power on the stress and plastic strain in the chip, gold bumps, and substrate were analyzed. The results indicated that the maximum stress and plastic strain occurred at gold bumps and the edge of under-bump metallization (UBM) layers for the global model, while the maximum stress at a single bump appeared in the central region. The pressure application position had a minor effect on reducing stress concentration, but had a significant effect on reducing plastic strain concentration. The pressure under various amplitudes had a major effect on the stress, while temperature had a minor effect. The results may provide some references for thermocompression ultrasonic flip bonding of chips." @default.
- W4366966532 created "2023-04-26" @default.
- W4366966532 creator A5001086205 @default.
- W4366966532 creator A5010235801 @default.
- W4366966532 creator A5019886822 @default.
- W4366966532 creator A5033622956 @default.
- W4366966532 creator A5038014359 @default.
- W4366966532 creator A5078628376 @default.
- W4366966532 creator A5080742544 @default.
- W4366966532 date "2023-04-01" @default.
- W4366966532 modified "2023-09-23" @default.
- W4366966532 title "Response Surface Analysis of Process Parameters for Thermocompression Ultrasonic Flip Bonding of Chips" @default.
- W4366966532 cites W1990461089 @default.
- W4366966532 cites W2009964805 @default.
- W4366966532 cites W2017910542 @default.
- W4366966532 cites W2023708935 @default.
- W4366966532 cites W2037235519 @default.
- W4366966532 cites W2292130855 @default.
- W4366966532 cites W2541425271 @default.
- W4366966532 cites W2873918292 @default.
- W4366966532 cites W2895051826 @default.
- W4366966532 cites W2904708710 @default.
- W4366966532 cites W2999550980 @default.
- W4366966532 cites W3025134762 @default.
- W4366966532 cites W3091735816 @default.
- W4366966532 cites W3164401185 @default.
- W4366966532 cites W3199327937 @default.
- W4366966532 cites W4224929830 @default.
- W4366966532 doi "https://doi.org/10.1109/tcpmt.2023.3269419" @default.
- W4366966532 hasPublicationYear "2023" @default.
- W4366966532 type Work @default.
- W4366966532 citedByCount "0" @default.
- W4366966532 crossrefType "journal-article" @default.
- W4366966532 hasAuthorship W4366966532A5001086205 @default.
- W4366966532 hasAuthorship W4366966532A5010235801 @default.
- W4366966532 hasAuthorship W4366966532A5019886822 @default.
- W4366966532 hasAuthorship W4366966532A5033622956 @default.
- W4366966532 hasAuthorship W4366966532A5038014359 @default.
- W4366966532 hasAuthorship W4366966532A5078628376 @default.
- W4366966532 hasAuthorship W4366966532A5080742544 @default.
- W4366966532 hasConcept C111106434 @default.
- W4366966532 hasConcept C111368507 @default.
- W4366966532 hasConcept C119599485 @default.
- W4366966532 hasConcept C121332964 @default.
- W4366966532 hasConcept C127313418 @default.
- W4366966532 hasConcept C127413603 @default.
- W4366966532 hasConcept C135628077 @default.
- W4366966532 hasConcept C138885662 @default.
- W4366966532 hasConcept C140269135 @default.
- W4366966532 hasConcept C159985019 @default.
- W4366966532 hasConcept C165005293 @default.
- W4366966532 hasConcept C171250308 @default.
- W4366966532 hasConcept C192562407 @default.
- W4366966532 hasConcept C201845621 @default.
- W4366966532 hasConcept C21036866 @default.
- W4366966532 hasConcept C24890656 @default.
- W4366966532 hasConcept C2777289219 @default.
- W4366966532 hasConcept C2779227376 @default.
- W4366966532 hasConcept C2781098093 @default.
- W4366966532 hasConcept C41895202 @default.
- W4366966532 hasConcept C66938386 @default.
- W4366966532 hasConcept C68928338 @default.
- W4366966532 hasConcept C79072407 @default.
- W4366966532 hasConcept C81288441 @default.
- W4366966532 hasConceptScore W4366966532C111106434 @default.
- W4366966532 hasConceptScore W4366966532C111368507 @default.
- W4366966532 hasConceptScore W4366966532C119599485 @default.
- W4366966532 hasConceptScore W4366966532C121332964 @default.
- W4366966532 hasConceptScore W4366966532C127313418 @default.
- W4366966532 hasConceptScore W4366966532C127413603 @default.
- W4366966532 hasConceptScore W4366966532C135628077 @default.
- W4366966532 hasConceptScore W4366966532C138885662 @default.
- W4366966532 hasConceptScore W4366966532C140269135 @default.
- W4366966532 hasConceptScore W4366966532C159985019 @default.
- W4366966532 hasConceptScore W4366966532C165005293 @default.
- W4366966532 hasConceptScore W4366966532C171250308 @default.
- W4366966532 hasConceptScore W4366966532C192562407 @default.
- W4366966532 hasConceptScore W4366966532C201845621 @default.
- W4366966532 hasConceptScore W4366966532C21036866 @default.
- W4366966532 hasConceptScore W4366966532C24890656 @default.
- W4366966532 hasConceptScore W4366966532C2777289219 @default.
- W4366966532 hasConceptScore W4366966532C2779227376 @default.
- W4366966532 hasConceptScore W4366966532C2781098093 @default.
- W4366966532 hasConceptScore W4366966532C41895202 @default.
- W4366966532 hasConceptScore W4366966532C66938386 @default.
- W4366966532 hasConceptScore W4366966532C68928338 @default.
- W4366966532 hasConceptScore W4366966532C79072407 @default.
- W4366966532 hasConceptScore W4366966532C81288441 @default.
- W4366966532 hasFunder F4320321001 @default.
- W4366966532 hasFunder F4320326279 @default.
- W4366966532 hasIssue "4" @default.
- W4366966532 hasLocation W43669665321 @default.
- W4366966532 hasOpenAccess W4366966532 @default.
- W4366966532 hasPrimaryLocation W43669665321 @default.
- W4366966532 hasRelatedWork W1589664903 @default.
- W4366966532 hasRelatedWork W1921171734 @default.
- W4366966532 hasRelatedWork W1961878373 @default.
- W4366966532 hasRelatedWork W1981897160 @default.