Matches in SemOpenAlex for { <https://semopenalex.org/work/W4367172085> ?p ?o ?g. }
- W4367172085 endingPage "6390" @default.
- W4367172085 startingPage "6378" @default.
- W4367172085 abstract "In the era of big data, the advantages of 3D packaging are becoming increasingly significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of the PCB and BGA components leads to dynamic warpage of the system, and the expansion and innovation of low-temperature soldering have been a new trend. We developed a fully mixed solder joint of a SAC305(Sn-3.0Ag-0.5Cu wt.%) solder ball and Sn–58Bi(wt.%) solder paste by solid-liquid low-temperature solder bonding technology. The mixing degree and diffusion process of the two were calculated and simulated by mathematical calculation and COMSOL Multiphysics. The results show that a completely mixed solder joint can be obtained after reflow at 210 °C for 5 min. The average shear strength of the composite solder joints was 63.68 ± 1.12 MPa, which was about twice that of the single SAC305 and Sn58Bi solder joints, and the shear fracture was a composite mode of brittle and ductile fracture, which appeared in the IMC and the solder, respectively. After complete mixing, the solder wettability angle was less than 26.68°, with outstanding wetting properties. No phase transition occurred after aging, the distribution of each phase remained uniform, and no enrichment of the brittle phase was observed at the interface. The shear strength decreased slightly with aging time, and the reduction value was less than 10 MPa, which has good reliability." @default.
- W4367172085 created "2023-04-28" @default.
- W4367172085 creator A5030627810 @default.
- W4367172085 creator A5036539664 @default.
- W4367172085 creator A5041038564 @default.
- W4367172085 creator A5060002817 @default.
- W4367172085 creator A5086405833 @default.
- W4367172085 creator A5087127970 @default.
- W4367172085 date "2023-05-01" @default.
- W4367172085 modified "2023-09-27" @default.
- W4367172085 title "Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology" @default.
- W4367172085 cites W1968459445 @default.
- W4367172085 cites W1969515952 @default.
- W4367172085 cites W1982553332 @default.
- W4367172085 cites W1997140420 @default.
- W4367172085 cites W1997601136 @default.
- W4367172085 cites W2002523173 @default.
- W4367172085 cites W2018920783 @default.
- W4367172085 cites W2023264348 @default.
- W4367172085 cites W2032408163 @default.
- W4367172085 cites W2034019649 @default.
- W4367172085 cites W2057355116 @default.
- W4367172085 cites W2064782593 @default.
- W4367172085 cites W2073461509 @default.
- W4367172085 cites W2084525959 @default.
- W4367172085 cites W2086170550 @default.
- W4367172085 cites W2098211668 @default.
- W4367172085 cites W2101678894 @default.
- W4367172085 cites W2112625179 @default.
- W4367172085 cites W2163221188 @default.
- W4367172085 cites W2345711080 @default.
- W4367172085 cites W2483196149 @default.
- W4367172085 cites W2502507749 @default.
- W4367172085 cites W2577489606 @default.
- W4367172085 cites W2766854515 @default.
- W4367172085 cites W2915914877 @default.
- W4367172085 cites W2920937158 @default.
- W4367172085 cites W2969885737 @default.
- W4367172085 cites W2975776890 @default.
- W4367172085 cites W3082681055 @default.
- W4367172085 cites W4200574658 @default.
- W4367172085 cites W4281771247 @default.
- W4367172085 cites W4281946234 @default.
- W4367172085 cites W4308462698 @default.
- W4367172085 doi "https://doi.org/10.1016/j.jmrt.2023.04.234" @default.
- W4367172085 hasPublicationYear "2023" @default.
- W4367172085 type Work @default.
- W4367172085 citedByCount "2" @default.
- W4367172085 countsByYear W43671720852023 @default.
- W4367172085 crossrefType "journal-article" @default.
- W4367172085 hasAuthorship W4367172085A5030627810 @default.
- W4367172085 hasAuthorship W4367172085A5036539664 @default.
- W4367172085 hasAuthorship W4367172085A5041038564 @default.
- W4367172085 hasAuthorship W4367172085A5060002817 @default.
- W4367172085 hasAuthorship W4367172085A5086405833 @default.
- W4367172085 hasAuthorship W4367172085A5087127970 @default.
- W4367172085 hasBestOaLocation W43671720851 @default.
- W4367172085 hasConcept C104779481 @default.
- W4367172085 hasConcept C127893833 @default.
- W4367172085 hasConcept C134514944 @default.
- W4367172085 hasConcept C136478896 @default.
- W4367172085 hasConcept C159390177 @default.
- W4367172085 hasConcept C159750122 @default.
- W4367172085 hasConcept C159985019 @default.
- W4367172085 hasConcept C191281628 @default.
- W4367172085 hasConcept C191897082 @default.
- W4367172085 hasConcept C192562407 @default.
- W4367172085 hasConcept C39432304 @default.
- W4367172085 hasConcept C47463417 @default.
- W4367172085 hasConcept C50296614 @default.
- W4367172085 hasConcept C94709252 @default.
- W4367172085 hasConceptScore W4367172085C104779481 @default.
- W4367172085 hasConceptScore W4367172085C127893833 @default.
- W4367172085 hasConceptScore W4367172085C134514944 @default.
- W4367172085 hasConceptScore W4367172085C136478896 @default.
- W4367172085 hasConceptScore W4367172085C159390177 @default.
- W4367172085 hasConceptScore W4367172085C159750122 @default.
- W4367172085 hasConceptScore W4367172085C159985019 @default.
- W4367172085 hasConceptScore W4367172085C191281628 @default.
- W4367172085 hasConceptScore W4367172085C191897082 @default.
- W4367172085 hasConceptScore W4367172085C192562407 @default.
- W4367172085 hasConceptScore W4367172085C39432304 @default.
- W4367172085 hasConceptScore W4367172085C47463417 @default.
- W4367172085 hasConceptScore W4367172085C50296614 @default.
- W4367172085 hasConceptScore W4367172085C94709252 @default.
- W4367172085 hasFunder F4320321001 @default.
- W4367172085 hasLocation W43671720851 @default.
- W4367172085 hasOpenAccess W4367172085 @default.
- W4367172085 hasPrimaryLocation W43671720851 @default.
- W4367172085 hasRelatedWork W1512319868 @default.
- W4367172085 hasRelatedWork W1662003158 @default.
- W4367172085 hasRelatedWork W1988327836 @default.
- W4367172085 hasRelatedWork W2063425262 @default.
- W4367172085 hasRelatedWork W2100504325 @default.
- W4367172085 hasRelatedWork W2290530404 @default.
- W4367172085 hasRelatedWork W2346183547 @default.
- W4367172085 hasRelatedWork W256746515 @default.
- W4367172085 hasRelatedWork W2801199743 @default.