Matches in SemOpenAlex for { <https://semopenalex.org/work/W4377697955> ?p ?o ?g. }
Showing items 1 to 70 of
70
with 100 items per page.
- W4377697955 abstract "An In-containing solder paste (DFLT) was developed and used in mobile phone assembly with a 200°C peak reflow temperature profile. Now an increased interest exists for low-temperature processing for first-level interconnects. Therefore, more research is needed to identify any reliability implications for SnAgCu-based bumps creating an interconnect using DFLT solder paste material. Testing was conducted on a wafer-level package (WLP256) application using various reflow profiles with peak temperatures ranging from 200°C (P200) to 240°C (P240). SAC305 was used as the control, which was reflowed using a traditional lead-free soldering profile (P240). Under the 200°C (P200) peak reflow, hybrid joints were formed in which the mixing zone, dominated by DFLT, was present at the PCB side while the area above the mixing zone maintained the original SAC305 morphology. By increasing the reflow peak temperature to 210°C (P210) and above, homogeneous joints were formed, which was similar to the traditional morphology of SAC305. The temperature cycling test (TCT) was conducted with a -40/125°C and 20-minute dwell profile. Regardless of the reflow profiles, DFLT outperformed SAC305 in TCT. The P210 profile resulted in the best TCT performance, which had more than a 30% improvement than the control using SAC305 paste. The other profiles also enhanced the characteristic life by at least 11%. Although the reflow profiles impacted the performance, the failure modes remained similar to SAC305." @default.
- W4377697955 created "2023-05-24" @default.
- W4377697955 creator A5034507101 @default.
- W4377697955 creator A5050829175 @default.
- W4377697955 date "2023-04-19" @default.
- W4377697955 modified "2023-09-26" @default.
- W4377697955 title "An In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305" @default.
- W4377697955 doi "https://doi.org/10.23919/icep58572.2023.10129775" @default.
- W4377697955 hasPublicationYear "2023" @default.
- W4377697955 type Work @default.
- W4377697955 citedByCount "0" @default.
- W4377697955 crossrefType "proceedings-article" @default.
- W4377697955 hasAuthorship W4377697955A5034507101 @default.
- W4377697955 hasAuthorship W4377697955A5050829175 @default.
- W4377697955 hasConcept C121332964 @default.
- W4377697955 hasConcept C123745756 @default.
- W4377697955 hasConcept C151637689 @default.
- W4377697955 hasConcept C153294291 @default.
- W4377697955 hasConcept C159985019 @default.
- W4377697955 hasConcept C160671074 @default.
- W4377697955 hasConcept C163258240 @default.
- W4377697955 hasConcept C177564732 @default.
- W4377697955 hasConcept C191281628 @default.
- W4377697955 hasConcept C192562407 @default.
- W4377697955 hasConcept C204530211 @default.
- W4377697955 hasConcept C2776584680 @default.
- W4377697955 hasConcept C31258907 @default.
- W4377697955 hasConcept C41008148 @default.
- W4377697955 hasConcept C43214815 @default.
- W4377697955 hasConcept C49040817 @default.
- W4377697955 hasConcept C50296614 @default.
- W4377697955 hasConcept C62520636 @default.
- W4377697955 hasConcept C70410870 @default.
- W4377697955 hasConcept C71924100 @default.
- W4377697955 hasConceptScore W4377697955C121332964 @default.
- W4377697955 hasConceptScore W4377697955C123745756 @default.
- W4377697955 hasConceptScore W4377697955C151637689 @default.
- W4377697955 hasConceptScore W4377697955C153294291 @default.
- W4377697955 hasConceptScore W4377697955C159985019 @default.
- W4377697955 hasConceptScore W4377697955C160671074 @default.
- W4377697955 hasConceptScore W4377697955C163258240 @default.
- W4377697955 hasConceptScore W4377697955C177564732 @default.
- W4377697955 hasConceptScore W4377697955C191281628 @default.
- W4377697955 hasConceptScore W4377697955C192562407 @default.
- W4377697955 hasConceptScore W4377697955C204530211 @default.
- W4377697955 hasConceptScore W4377697955C2776584680 @default.
- W4377697955 hasConceptScore W4377697955C31258907 @default.
- W4377697955 hasConceptScore W4377697955C41008148 @default.
- W4377697955 hasConceptScore W4377697955C43214815 @default.
- W4377697955 hasConceptScore W4377697955C49040817 @default.
- W4377697955 hasConceptScore W4377697955C50296614 @default.
- W4377697955 hasConceptScore W4377697955C62520636 @default.
- W4377697955 hasConceptScore W4377697955C70410870 @default.
- W4377697955 hasConceptScore W4377697955C71924100 @default.
- W4377697955 hasLocation W43776979551 @default.
- W4377697955 hasOpenAccess W4377697955 @default.
- W4377697955 hasPrimaryLocation W43776979551 @default.
- W4377697955 hasRelatedWork W164972606 @default.
- W4377697955 hasRelatedWork W1877920779 @default.
- W4377697955 hasRelatedWork W1959835886 @default.
- W4377697955 hasRelatedWork W1970352112 @default.
- W4377697955 hasRelatedWork W2002447563 @default.
- W4377697955 hasRelatedWork W2099977505 @default.
- W4377697955 hasRelatedWork W2130484472 @default.
- W4377697955 hasRelatedWork W2165304696 @default.
- W4377697955 hasRelatedWork W2809431270 @default.
- W4377697955 hasRelatedWork W3212985093 @default.
- W4377697955 isParatext "false" @default.
- W4377697955 isRetracted "false" @default.
- W4377697955 workType "article" @default.