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- W4377698509 abstract "TSV filling process using electroless plating of CoWB barrier layer and direct electroplating of Cu on it was demonstrated. Conformal deposition of the barrier layer was performed for the high aspect ratio TSVs. Cu electrodeposition profiles for TSVs were studied by varying additive concentration and current density. Adhesion property measured by stud-pull test suggested that the annealing at 200 °C drastically improve adhesion strength of both a barrier layer and Cu/barrier stacked structures." @default.
- W4377698509 created "2023-05-24" @default.
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- W4377698509 date "2023-04-19" @default.
- W4377698509 modified "2023-10-17" @default.
- W4377698509 title "Direct Cu electroplating on CoWB electroless barrier layer" @default.
- W4377698509 cites W2001193082 @default.
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- W4377698509 doi "https://doi.org/10.23919/icep58572.2023.10129727" @default.
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