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- W4377698532 abstract "The research and discussion in this paper, there are package design with the structure of FOCoS for an actual high-performance computing IC device with two ASIC chips. In the process of this actual project, the design platform named SiP-id (System-in-Package Intelligent Design) was used to complete the routings of ultra-high density I/O such as Fan-Out redistribution layer (RDL). Compared with the traditional design platform, it was greatly pull-in design cycle time. The design time and the accuracy of the design are improved obviously. In addition, this paper also delivers a lot of self-developed programs to link up the design and validation tools from different vendors." @default.
- W4377698532 created "2023-05-24" @default.
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- W4377698532 date "2023-04-19" @default.
- W4377698532 modified "2023-09-26" @default.
- W4377698532 title "Semiconductor Package Design Flow and Platform Applied on Fan-out Chip on Substrate" @default.
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- W4377698532 doi "https://doi.org/10.23919/icep58572.2023.10129673" @default.
- W4377698532 hasPublicationYear "2023" @default.
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