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- W4377698536 abstract "Exploiting the growth rate dependency of intermetallic compounds (IMCs) on the substrate composition, the possibility of controlling porosity during transient liquid phase (TLP) bonding via a composition gradient is investigated. A Cu substrate with a variable Ni concentration was prepared through selective electroplating and subsequent heat treatment. When this substrate reacted with a molten Sn-rich alloy, there was a non-uniform growth of the Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> IMC. It is proposed that by tailoring the direction of the composition gradient in the substrate, the IMC growth rate can be controlled in such a way as to progressively move the solid-liquid front to redistribute any porosity away from the central region of the joint and thereby improve reliability." @default.
- W4377698536 created "2023-05-24" @default.
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- W4377698536 date "2023-04-19" @default.
- W4377698536 modified "2023-09-27" @default.
- W4377698536 title "Controlling porosity during transient liquid phase bonding for high-temperature soldering processes" @default.
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- W4377698536 doi "https://doi.org/10.23919/icep58572.2023.10129722" @default.
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