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- W4377699468 abstract "This paper examined the effect of triethanolamine (TEA) and related surfactants on the electrical conductivity and reliability of copper-filled electrically conductive pastes. The TEA surfactant effectively enhanced the electrical conductivity but not the electrical reliability in an 85°C/85%RH environment. When the TEA surfactant was used, the co-applying of oleic acid improved electrical reliability. The tris(2-amino ethyl)amine (TREN), which has a molecular structure with amino groups by substituting TEA hydroxyl groups, enhanced electrical conductivity and reliability. Because the surfactants can sensitively control the electrical conductivity and reliability, the molecular design will be critical in developing advanced Cu-filled pastes." @default.
- W4377699468 created "2023-05-24" @default.
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- W4377699468 date "2023-04-19" @default.
- W4377699468 modified "2023-10-17" @default.
- W4377699468 title "Molecular Design of Amine-Based Surfactants for Improving Electrical Reliability of Copper-Filled Conductive Pastes" @default.
- W4377699468 cites W2944510738 @default.
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- W4377699468 doi "https://doi.org/10.23919/icep58572.2023.10129670" @default.
- W4377699468 hasPublicationYear "2023" @default.
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