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• W4380487841 abstract "In bi-adhesive single-lap joints (SLJs), longitudinal grading of adhesive compliance leads to peak stress concentration to the bi-adhesive interface (due to mismatch in properties). Due to this additional stress concentration at the bi-adhesive interface, the failure initiation threshold is lowered. In this paper, the stress distribution in the compliance-tailored bi-adhesive joints is investigated numerically. Peak stress at the bi-adhesive interface is diffused by geometrically grading the bi-adhesive interface in the longitudinal and transverse (through the thickness) directions. Linear and non-linear (material and geometric) finite element (FE) analyses were performed for two different set of bi-adhesive bondlines and joint configurations. FE results were benchmarked with published experimental and numerical data. Peak peel stress and peak shear stress are decreased by 29–70% and 8%, respectively, when the bi-adhesive interface is graded geometrically in the transverse and longitudinal directions as opposed to longitudinal tailoring alone. Moreover, the bi-adhesive interface’s stress concentration is reduced significantly. This leads to a more homogeneous stress distribution throughout the bond-layer. A thorough investigation reveals that through-thickness compliance tailoring of the bi-adhesive in SLJ can be used to increase tolerance to high load levels, achieve uniform stress distribution along the bond-layer, and reach the optimum joint stiffness.HighlightsA new approach for stress mitigation involving through the thickness tailoring of adhesive is introducedProposed approach is validated for two sets of bi-adhesive systems and two joint configurationsFinite element results are validated with published experimental dataLoad carrying capacity of joints is enhanced by diffusing peak stresses away from the bi-adhesive interface" @default.
• W4380487841 created "2023-06-14" @default.
• W4380487841 creator A5029414383 @default.
• W4380487841 creator A5033676161 @default.
• W4380487841 creator A5049434423 @default.
• W4380487841 date "2023-06-13" @default.
• W4380487841 modified "2023-10-16" @default.
• W4380487841 title "A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints" @default.
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• W4380487841 doi "https://doi.org/10.1080/01694243.2023.2217674" @default.
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