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- W4380884644 abstract "Electroless Ni-P films (19, 13 and 6 at. % P), Ni95P4W1.1 and Ni91P5Mo4W0.4 deposits on Cu(Zn) substrates were annealed at temperatures up to 450°C. Fracture toughness was evaluated by observing the level of cracking after indentation with a Vickers indenter. The films are mixtures of amorphous a-NiP, fcc-Ni and Ni3P, and their amounts vary with film composition and annealing temperature. The amounts of these phases, as well as film stress, crystallite sizes, preferred orientation and peak shapes were determined with X-ray diffraction (XRD). In the as-made state, all films are ductile and do not crack upon indentation. We show that embrittlement coincides with the transformation of a-NiP to Ni3P, and it is most severe for alloys with high phosphorus content. For Ni91P5Mo4W0.4, there is no Ni3P precipitation after annealing. Annealing increases the hardness of this deposit, and its fracture toughness remains high. Alloyed W and Mo are mostly dissolved in the fcc-Ni phase. Without Mo and W, the shape of fcc XRD peaks changes upon heating, whereas, in the Ni91P5Mo4W0.4, deposit constant peak shapes indicate a constant dislocation density. Independent of composition, film stress changes gradually with increasing annealing temperature from tensile to compressive due to differential thermal expansion of film and substrate." @default.
- W4380884644 created "2023-06-17" @default.
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- W4380884644 date "2023-08-01" @default.
- W4380884644 modified "2023-09-27" @default.
- W4380884644 title "Thermal evolution, phase composition and fracture toughness of electroless Ni-P, Ni-W-P and Ni-Mo-W-P films for solderable surfaces on copper" @default.
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- W4380884644 doi "https://doi.org/10.1016/j.surfcoat.2023.129722" @default.
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