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- W4381569268 endingPage "1149" @default.
- W4381569268 startingPage "1149" @default.
- W4381569268 abstract "The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors-thermal management, mechanical stress and electrical properties-can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package." @default.
- W4381569268 created "2023-06-22" @default.
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- W4381569268 creator A5091227928 @default.
- W4381569268 date "2023-05-29" @default.
- W4381569268 modified "2023-09-26" @default.
- W4381569268 title "A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging" @default.
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- W4381569268 doi "https://doi.org/10.3390/mi14061149" @default.
- W4381569268 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/37374734" @default.
- W4381569268 hasPublicationYear "2023" @default.
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