FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W4382068595> ?p ?o ?g. }

• W4382068595 endingPage "1297" @default.
• W4382068595 startingPage "1297" @default.
• W4382068595 abstract "Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si-Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of this application (its high-pressure resistance of ~200 bar, in particular), its use is reported to be a challenging and expensive process. In this study, we evaluated two alternative bonding methods, aiming toward a more cost-effective fabrication process: Si-Glass-Si anodic bonding (AB) with a thin-film glass, and Au-Au thermocompression (TC). The bonding strengths of the two methods were evaluated with destructive pressure burst tests (0-690 bar) on test structures, each made of a 1 × 2 cm2 silicon die etched with a tank and an inlet channel and sealed with a plain silicon die using either the AB or TC bonding. The pressure resistance of the structures was measured to be higher for the TC-sealed samples (max. 690 bar) than for the AB samples (max. 530 bar), but less homogeneous. The failure analysis indicated that the AB structure resistance was limited by the adhesion force of the deposited layers. Nevertheless, both the TC and AB methods provided sufficient bond quality to hold the high pressure required for application in high-energy physics pixel detector cooling." @default.
• W4382068595 created "2023-06-27" @default.
• W4382068595 creator A5002087341 @default.
• W4382068595 creator A5007994744 @default.
• W4382068595 creator A5039274809 @default.
• W4382068595 creator A5047835182 @default.
• W4382068595 creator A5059786273 @default.
• W4382068595 creator A5060118255 @default.
• W4382068595 creator A5062540461 @default.
• W4382068595 creator A5084118439 @default.
• W4382068595 creator A5090449885 @default.
• W4382068595 date "2023-06-24" @default.
• W4382068595 modified "2023-10-14" @default.
• W4382068595 title "Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices" @default.
• W4382068595 cites W1976247260 @default.
• W4382068595 cites W2027636564 @default.
• W4382068595 cites W2033414592 @default.
• W4382068595 cites W2048333567 @default.
• W4382068595 cites W2064912790 @default.
• W4382068595 cites W2125763409 @default.
• W4382068595 cites W2139279778 @default.
• W4382068595 cites W2156259175 @default.
• W4382068595 cites W2176173608 @default.
• W4382068595 cites W2563677375 @default.
• W4382068595 cites W2741351374 @default.
• W4382068595 cites W2778582630 @default.
• W4382068595 cites W3083958169 @default.
• W4382068595 cites W3104943921 @default.
• W4382068595 cites W4281556543 @default.
• W4382068595 doi "https://doi.org/10.3390/mi14071297" @default.
• W4382068595 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/37512608" @default.
• W4382068595 hasPublicationYear "2023" @default.
• W4382068595 type Work @default.
• W4382068595 citedByCount "0" @default.
• W4382068595 crossrefType "journal-article" @default.
• W4382068595 hasAuthorship W4382068595A5002087341 @default.
• W4382068595 hasAuthorship W4382068595A5007994744 @default.
• W4382068595 hasAuthorship W4382068595A5039274809 @default.
• W4382068595 hasAuthorship W4382068595A5047835182 @default.
• W4382068595 hasAuthorship W4382068595A5059786273 @default.
• W4382068595 hasAuthorship W4382068595A5060118255 @default.
• W4382068595 hasAuthorship W4382068595A5062540461 @default.
• W4382068595 hasAuthorship W4382068595A5084118439 @default.
• W4382068595 hasAuthorship W4382068595A5090449885 @default.
• W4382068595 hasBestOaLocation W43820685951 @default.
• W4382068595 hasConcept C121332964 @default.
• W4382068595 hasConcept C136525101 @default.
• W4382068595 hasConcept C142724271 @default.
• W4382068595 hasConcept C147789679 @default.
• W4382068595 hasConcept C153294291 @default.
• W4382068595 hasConcept C159985019 @default.
• W4382068595 hasConcept C160671074 @default.
• W4382068595 hasConcept C171250308 @default.
• W4382068595 hasConcept C17525397 @default.
• W4382068595 hasConcept C185592680 @default.
• W4382068595 hasConcept C188721877 @default.
• W4382068595 hasConcept C192562407 @default.
• W4382068595 hasConcept C201414436 @default.
• W4382068595 hasConcept C201845621 @default.
• W4382068595 hasConcept C204787440 @default.
• W4382068595 hasConcept C2779133538 @default.
• W4382068595 hasConcept C2779227376 @default.
• W4382068595 hasConcept C49040817 @default.
• W4382068595 hasConcept C544956773 @default.
• W4382068595 hasConcept C63662833 @default.
• W4382068595 hasConcept C71924100 @default.
• W4382068595 hasConcept C89395315 @default.
• W4382068595 hasConceptScore W4382068595C121332964 @default.
• W4382068595 hasConceptScore W4382068595C136525101 @default.
• W4382068595 hasConceptScore W4382068595C142724271 @default.
• W4382068595 hasConceptScore W4382068595C147789679 @default.
• W4382068595 hasConceptScore W4382068595C153294291 @default.
• W4382068595 hasConceptScore W4382068595C159985019 @default.
• W4382068595 hasConceptScore W4382068595C160671074 @default.
• W4382068595 hasConceptScore W4382068595C171250308 @default.
• W4382068595 hasConceptScore W4382068595C17525397 @default.
• W4382068595 hasConceptScore W4382068595C185592680 @default.
• W4382068595 hasConceptScore W4382068595C188721877 @default.
• W4382068595 hasConceptScore W4382068595C192562407 @default.
• W4382068595 hasConceptScore W4382068595C201414436 @default.
• W4382068595 hasConceptScore W4382068595C201845621 @default.
• W4382068595 hasConceptScore W4382068595C204787440 @default.
• W4382068595 hasConceptScore W4382068595C2779133538 @default.
• W4382068595 hasConceptScore W4382068595C2779227376 @default.
• W4382068595 hasConceptScore W4382068595C49040817 @default.
• W4382068595 hasConceptScore W4382068595C544956773 @default.
• W4382068595 hasConceptScore W4382068595C63662833 @default.
• W4382068595 hasConceptScore W4382068595C71924100 @default.
• W4382068595 hasConceptScore W4382068595C89395315 @default.
• W4382068595 hasIssue "7" @default.
• W4382068595 hasLocation W43820685951 @default.
• W4382068595 hasLocation W43820685952 @default.
• W4382068595 hasLocation W43820685953 @default.
• W4382068595 hasLocation W43820685954 @default.
• W4382068595 hasLocation W43820685955 @default.
• W4382068595 hasLocation W43820685956 @default.
• W4382068595 hasOpenAccess W4382068595 @default.
• W4382068595 hasPrimaryLocation W43820685951 @default.

• next