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- W4383998701 abstract "Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film circuitry composed of silver flakes and a water-based polyurethane dispersion. This ink uniquely combines high electrical conductivity (1.6 × 105 S m-1 ), high resolution digital printability, robust adhesion for microchip integration, mechanical resilience, and recyclability. Recycling is achieved with an ecologically-friendly processing method to decompose the circuits into constituent elements and recover the conductive ink with a decrease of only 2.4% in conductivity. Moreover, adding liquid metal enables stretchability of up to 200% strain, although this introduces the need for more complex recycling steps. Finally, on-skin electrophysiological monitoring biostickers along with a recyclable smart package with integrated sensors for monitoring safe storage of perishable foods are demonstrated." @default.
- W4383998701 created "2023-07-13" @default.
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- W4383998701 date "2023-07-12" @default.
- W4383998701 modified "2023-10-11" @default.
- W4383998701 title "Recyclable Thin‐Film Soft Electronics for Smart Packaging and E‐Skins" @default.
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- W4383998701 doi "https://doi.org/10.1002/advs.202301673" @default.
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