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- W4384080227 abstract "This paper proposes a miniature 3D SIP (system in package) design of the four-channel RF transceiver. The Key advancement is the demonstration of 3D stacking of silicon carriers and ALN (aluminium nitride) HTCC carrier based on 70 um Au micro-bumps. The influences of the carrier on the performance of GaAs (gallium arsenide) MMICs are analyzed in detail. A new silicon carrier with hollow annular TSV and non-metalized cavity is proposed, which is characterized by less impact on MMIC performance, more compact stacking size and lower fabrication cost. The GaAs MMICs, silicon and ALN carriers are heterogeneous integrated and stacked vertically to form a 3D SIP. The proposed hermetic 3D SIP is highly integrated in a volume of 12.7 mm × 13.9 mm × 3.6 mm with 7 × 8 BGA (ball grid array) input and output ports, and capable of working with four different types of passbands for anti-jamming. Measured results indicate that the SIP has the advantages of high reliability, high performance and mass manufacture." @default.
- W4384080227 created "2023-07-13" @default.
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- W4384080227 date "2023-07-01" @default.
- W4384080227 modified "2023-10-17" @default.
- W4384080227 title "Three-Dimensional SIP Design of the Four-Channel RF Transceiver Based on Silicon and ALN for <i>X</i>-Band Radar Applications" @default.
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- W4384080227 doi "https://doi.org/10.1109/tcpmt.2023.3294477" @default.
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