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- W4385293840 abstract "Abstract The monotonic plastic flow behavior and deformation kinetics of solder joints in shear at room temperature were determined for some dozen dilute Sn solders designed for Pb-free alternatives in electronic packages. In, Bi, Ag and Cu elements were involved in alloys based on Sn. The Bi solute atoms (s.a) in the Sn host lattice were found to be a significant species in solid solution strengthening and the In s.a. a significant species in impeding recovery. The Bi solute strengthening process was in accord with Labusch’s statistical model (Labusch, 1970). The model relation otherwise predicted a Bi and In interaction strengthening. The rate-controlling mechanisms in recovery were speculated to be an In-solute-viscous-dragging and glide-controlled creep and a Bi-solute-dragging and climb-controlled creep in the corresponding alloys. The actions of electron concentration (e/a) were noted." @default.
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- W4385293840 date "1996-11-17" @default.
- W4385293840 modified "2023-10-01" @default.
- W4385293840 title "The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages" @default.
- W4385293840 doi "https://doi.org/10.1115/imece1996-0786" @default.
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