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- W4385326757 abstract "Abstract One of the essential thick film materials on the hybrid circuit is the conductor which performs as an interconnection between discrete components. However, metallurgical reaction between the conductor and solder during the soldering or thermal aging/cycling may cause electrical failure and/or loss of adhesive strength due to the reaction of Ag/Pd with Sn and subsequent intermetallics formed. A step soldering process, which applies a high-Pb solder layer over the conductor layer before the eutectic or near-eutectic Sn-Pb solder is applied, has been shown to prevent contact between the conductor and Sn in the solder, as long as the high-Pb layer does not dissolve into the low-Pb layer. Experiments were carried out to quantify the isothermal interdiffusion reaction rate and the interface displacement between the 88Pb-10Sn-2Ag and the eutectic 63Sn-37Pb solder layers between 195 and 235°C. The results were analyzed by the methodology developed by Lommel and Chalmers (1959) which was based on Nernst-Brunner theory of dissolution (Moelwyn-Hughes, 1947). The displacement of the interface follows an Arrhenius relationship with an activation energy of 98 KJ/mole, which is close to the activation energy of solid Sn diffusion into Pb. A process window was constructed to show that temperature is a more sensitive parameter influencing the reaction rate than time. A mathematical model was applied to predict the interfacial displacement during the reflow process and was found to correlate well with experimental results." @default.
- W4385326757 created "2023-07-28" @default.
- W4385326757 creator A5000719696 @default.
- W4385326757 creator A5004178542 @default.
- W4385326757 creator A5029981300 @default.
- W4385326757 creator A5060989934 @default.
- W4385326757 creator A5061398868 @default.
- W4385326757 creator A5086743052 @default.
- W4385326757 date "1996-11-17" @default.
- W4385326757 modified "2023-09-26" @default.
- W4385326757 title "Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads" @default.
- W4385326757 doi "https://doi.org/10.1115/imece1996-0898" @default.
- W4385326757 hasPublicationYear "1996" @default.
- W4385326757 type Work @default.
- W4385326757 citedByCount "0" @default.
- W4385326757 crossrefType "proceedings-article" @default.
- W4385326757 hasAuthorship W4385326757A5000719696 @default.
- W4385326757 hasAuthorship W4385326757A5004178542 @default.
- W4385326757 hasAuthorship W4385326757A5029981300 @default.
- W4385326757 hasAuthorship W4385326757A5060989934 @default.
- W4385326757 hasAuthorship W4385326757A5061398868 @default.
- W4385326757 hasAuthorship W4385326757A5086743052 @default.
- W4385326757 hasConcept C121332964 @default.
- W4385326757 hasConcept C127413603 @default.
- W4385326757 hasConcept C133347239 @default.
- W4385326757 hasConcept C138055206 @default.
- W4385326757 hasConcept C159985019 @default.
- W4385326757 hasConcept C177564732 @default.
- W4385326757 hasConcept C178790620 @default.
- W4385326757 hasConcept C18168003 @default.
- W4385326757 hasConcept C185592680 @default.
- W4385326757 hasConcept C191897082 @default.
- W4385326757 hasConcept C192562407 @default.
- W4385326757 hasConcept C204530211 @default.
- W4385326757 hasConcept C27501479 @default.
- W4385326757 hasConcept C2779227376 @default.
- W4385326757 hasConcept C2780026712 @default.
- W4385326757 hasConcept C34800285 @default.
- W4385326757 hasConcept C42360764 @default.
- W4385326757 hasConcept C50296614 @default.
- W4385326757 hasConcept C86183883 @default.
- W4385326757 hasConcept C87976508 @default.
- W4385326757 hasConcept C88380143 @default.
- W4385326757 hasConcept C95121573 @default.
- W4385326757 hasConcept C97355855 @default.
- W4385326757 hasConceptScore W4385326757C121332964 @default.
- W4385326757 hasConceptScore W4385326757C127413603 @default.
- W4385326757 hasConceptScore W4385326757C133347239 @default.
- W4385326757 hasConceptScore W4385326757C138055206 @default.
- W4385326757 hasConceptScore W4385326757C159985019 @default.
- W4385326757 hasConceptScore W4385326757C177564732 @default.
- W4385326757 hasConceptScore W4385326757C178790620 @default.
- W4385326757 hasConceptScore W4385326757C18168003 @default.
- W4385326757 hasConceptScore W4385326757C185592680 @default.
- W4385326757 hasConceptScore W4385326757C191897082 @default.
- W4385326757 hasConceptScore W4385326757C192562407 @default.
- W4385326757 hasConceptScore W4385326757C204530211 @default.
- W4385326757 hasConceptScore W4385326757C27501479 @default.
- W4385326757 hasConceptScore W4385326757C2779227376 @default.
- W4385326757 hasConceptScore W4385326757C2780026712 @default.
- W4385326757 hasConceptScore W4385326757C34800285 @default.
- W4385326757 hasConceptScore W4385326757C42360764 @default.
- W4385326757 hasConceptScore W4385326757C50296614 @default.
- W4385326757 hasConceptScore W4385326757C86183883 @default.
- W4385326757 hasConceptScore W4385326757C87976508 @default.
- W4385326757 hasConceptScore W4385326757C88380143 @default.
- W4385326757 hasConceptScore W4385326757C95121573 @default.
- W4385326757 hasConceptScore W4385326757C97355855 @default.
- W4385326757 hasLocation W43853267571 @default.
- W4385326757 hasOpenAccess W4385326757 @default.
- W4385326757 hasPrimaryLocation W43853267571 @default.
- W4385326757 hasRelatedWork W1981717641 @default.
- W4385326757 hasRelatedWork W1986854664 @default.
- W4385326757 hasRelatedWork W2002014073 @default.
- W4385326757 hasRelatedWork W2025072024 @default.
- W4385326757 hasRelatedWork W2025188144 @default.
- W4385326757 hasRelatedWork W2056596629 @default.
- W4385326757 hasRelatedWork W2071455146 @default.
- W4385326757 hasRelatedWork W2082407764 @default.
- W4385326757 hasRelatedWork W2790723184 @default.
- W4385326757 hasRelatedWork W2186288722 @default.
- W4385326757 isParatext "false" @default.
- W4385326757 isRetracted "false" @default.
- W4385326757 workType "article" @default.