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- W4385337942 abstract "A millimeter-wave (mmWave) wideband tightly coupled antenna (TCA) for endfire radiation is devised and realized using fan-out wafer-level packaging (FOWLP) technology for the first time in literature. The proposed FOWLP TCA achieves a wide bandwidth from 50 to 100 GHz. The proposed topology is integrated with a CMOS transmitter using low-loss heterogeneous interconnects and flip-chip bonding process between the die-FOWLP-FR4 interface. Moreover, the cost-effective E-band FOWLP TX module containing the TCA is fully operational and exhibits 1.2 dBm EIRP including all real-life loss parameters. A series of Over-The-Air (OTA) measurements are carried out in conjunction with link budget analysis. The FOWLP TCA exhibits a minimum 5.19 dBi gain and ±45° beam steering across the operational bandwidth. This topology demonstrates a new class of efficient and cost-effect strategy for multi-functional, low-profile, highly integrated antenna modules for wireless communications, radars, and sensing at mmWave and terahertz spectrum." @default.
- W4385337942 created "2023-07-29" @default.
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- W4385337942 date "2023-06-11" @default.
- W4385337942 modified "2023-09-26" @default.
- W4385337942 title "Design, Fabrication, and Far-Field Measurement of FOWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications" @default.
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- W4385337942 doi "https://doi.org/10.1109/ims37964.2023.10187963" @default.
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