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• W4385413563 startingPage "1209" @default.
• W4385413563 abstract "Thermo-mechanical stress caused by the coefficient of thermal expansion (CTE) mismatch leads to the formation of cracks, delamination, and warpage in the sintered nano-silver (S-Ag) layer, which eventually results in the fatigue failure of SiC semiconductor devices. Herein, the gradient porosity distribution method was proposed to simultaneously reduce the maximum thermo-mechanical stress and homogenize the stress distribution. The influence of different porosity distribution on the maximum thermo-mechanical stress and strain in S-Ag layer was investigated by finite element simulation. The gradient porosity distribution structure (S1>2 and S1<2) effectively reduced the maximum thermo-mechanical stress and strain by 8.4% and 8.0% compared to the conventional uniform porosity structure (S1=2). S-Ag bonding samples with S1=2, S1>2 and S1<2 structures were prepared to confirm the simulation results, which exhibited similar shear strengths. After 500 cycles of thermal shock test, the delamination rates of S1>2 and S1<2 bonding samples were 7.7% and 9.8%, which were 5.0% and 2.9% lower than S1=2 bonding samples, respectively. Both finite element simulation and experimental verification results demonstrate the positive effect of gradient porosity distribution structure on alleviating the thermo-mechanical fatigue failure caused by CTE mismatch." @default.
• W4385413563 created "2023-08-01" @default.
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• W4385413563 date "2023-08-01" @default.
• W4385413563 modified "2023-10-15" @default.
• W4385413563 title "Reliability Improvement of Low-temperature Sintered Nano-silver as Die Attachment by Porosity Optimization" @default.
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• W4385413563 doi "https://doi.org/10.1109/tcpmt.2023.3299291" @default.
• W4385413563 hasPublicationYear "2023" @default.
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