Matches in SemOpenAlex for { <https://semopenalex.org/work/W4385532512> ?p ?o ?g. }
Showing items 1 to 100 of
100
with 100 items per page.
- W4385532512 abstract "2.5D silicon interposer for multi-die heterogeneous integration is the mainstream package architecture for a high- performance computing (HPC) and an artificial intelligence (AI) application. In this study, 3.5D package is demonstrated to combine 2.5D silicon interposer and 3D architecture to obtain high-performance and high-density interconnection with the small footprint system package. Extremely large Si interposer (4x reticle size) was manufactured and integrated with multi logic test chips with 12-HBMs, 3-chiplets and 3D-ASIC. 3D-ASIC was manufactured by vertical interconnection of two partitioned chips by Cu-Cu hybrid bonding. 3D-ASIC will be able to overcome effectively the single chip reticle size limitation and large die yield issue in Si fabrication. Furthermore 12-HBMs and 3-chiplets were assembled on silicon interposer using Chip on Wafer (CoW) process for higher system bandwidth. 3D-ASIC was attached on silicon interposer by solder reflow bonding process with 40um bump pitch. To avoid underfill void on narrow chip gap and die to die space, vacuum devoid process was introduced and the underfill void under multi-chip was completely removed. The extremely large molded Si interposer with multi-die was assembled on organic substrate successfully showing the reliable joint quality by controlling molded Si interposer and substrate warpage effectively. The interfacial stress between various multi-heterogeneous chips was analyzed through finite element method (FEM) simulation and the impact on reliability will be discussed." @default.
- W4385532512 created "2023-08-04" @default.
- W4385532512 creator A5034121268 @default.
- W4385532512 creator A5038577249 @default.
- W4385532512 creator A5048416035 @default.
- W4385532512 creator A5050477304 @default.
- W4385532512 creator A5053987349 @default.
- W4385532512 creator A5056191836 @default.
- W4385532512 creator A5068488203 @default.
- W4385532512 creator A5071375044 @default.
- W4385532512 date "2023-05-01" @default.
- W4385532512 modified "2023-09-22" @default.
- W4385532512 title "Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology" @default.
- W4385532512 doi "https://doi.org/10.1109/ectc51909.2023.00154" @default.
- W4385532512 hasPublicationYear "2023" @default.
- W4385532512 type Work @default.
- W4385532512 citedByCount "0" @default.
- W4385532512 crossrefType "proceedings-article" @default.
- W4385532512 hasAuthorship W4385532512A5034121268 @default.
- W4385532512 hasAuthorship W4385532512A5038577249 @default.
- W4385532512 hasAuthorship W4385532512A5048416035 @default.
- W4385532512 hasAuthorship W4385532512A5050477304 @default.
- W4385532512 hasAuthorship W4385532512A5053987349 @default.
- W4385532512 hasAuthorship W4385532512A5056191836 @default.
- W4385532512 hasAuthorship W4385532512A5068488203 @default.
- W4385532512 hasAuthorship W4385532512A5071375044 @default.
- W4385532512 hasConcept C100460472 @default.
- W4385532512 hasConcept C111106434 @default.
- W4385532512 hasConcept C119599485 @default.
- W4385532512 hasConcept C123745756 @default.
- W4385532512 hasConcept C125619702 @default.
- W4385532512 hasConcept C126233035 @default.
- W4385532512 hasConcept C127413603 @default.
- W4385532512 hasConcept C146667757 @default.
- W4385532512 hasConcept C158802814 @default.
- W4385532512 hasConcept C159985019 @default.
- W4385532512 hasConcept C160671074 @default.
- W4385532512 hasConcept C165005293 @default.
- W4385532512 hasConcept C171250308 @default.
- W4385532512 hasConcept C186260285 @default.
- W4385532512 hasConcept C192562407 @default.
- W4385532512 hasConcept C24326235 @default.
- W4385532512 hasConcept C2779227376 @default.
- W4385532512 hasConcept C2779772531 @default.
- W4385532512 hasConcept C2780288131 @default.
- W4385532512 hasConcept C31258907 @default.
- W4385532512 hasConcept C41008148 @default.
- W4385532512 hasConcept C45632049 @default.
- W4385532512 hasConcept C49040817 @default.
- W4385532512 hasConcept C50296614 @default.
- W4385532512 hasConcept C530198007 @default.
- W4385532512 hasConcept C59088047 @default.
- W4385532512 hasConcept C68928338 @default.
- W4385532512 hasConcept C77390884 @default.
- W4385532512 hasConcept C79072407 @default.
- W4385532512 hasConceptScore W4385532512C100460472 @default.
- W4385532512 hasConceptScore W4385532512C111106434 @default.
- W4385532512 hasConceptScore W4385532512C119599485 @default.
- W4385532512 hasConceptScore W4385532512C123745756 @default.
- W4385532512 hasConceptScore W4385532512C125619702 @default.
- W4385532512 hasConceptScore W4385532512C126233035 @default.
- W4385532512 hasConceptScore W4385532512C127413603 @default.
- W4385532512 hasConceptScore W4385532512C146667757 @default.
- W4385532512 hasConceptScore W4385532512C158802814 @default.
- W4385532512 hasConceptScore W4385532512C159985019 @default.
- W4385532512 hasConceptScore W4385532512C160671074 @default.
- W4385532512 hasConceptScore W4385532512C165005293 @default.
- W4385532512 hasConceptScore W4385532512C171250308 @default.
- W4385532512 hasConceptScore W4385532512C186260285 @default.
- W4385532512 hasConceptScore W4385532512C192562407 @default.
- W4385532512 hasConceptScore W4385532512C24326235 @default.
- W4385532512 hasConceptScore W4385532512C2779227376 @default.
- W4385532512 hasConceptScore W4385532512C2779772531 @default.
- W4385532512 hasConceptScore W4385532512C2780288131 @default.
- W4385532512 hasConceptScore W4385532512C31258907 @default.
- W4385532512 hasConceptScore W4385532512C41008148 @default.
- W4385532512 hasConceptScore W4385532512C45632049 @default.
- W4385532512 hasConceptScore W4385532512C49040817 @default.
- W4385532512 hasConceptScore W4385532512C50296614 @default.
- W4385532512 hasConceptScore W4385532512C530198007 @default.
- W4385532512 hasConceptScore W4385532512C59088047 @default.
- W4385532512 hasConceptScore W4385532512C68928338 @default.
- W4385532512 hasConceptScore W4385532512C77390884 @default.
- W4385532512 hasConceptScore W4385532512C79072407 @default.
- W4385532512 hasLocation W43855325121 @default.
- W4385532512 hasOpenAccess W4385532512 @default.
- W4385532512 hasPrimaryLocation W43855325121 @default.
- W4385532512 hasRelatedWork W1515965320 @default.
- W4385532512 hasRelatedWork W1600708258 @default.
- W4385532512 hasRelatedWork W2026963460 @default.
- W4385532512 hasRelatedWork W2038124782 @default.
- W4385532512 hasRelatedWork W2110643457 @default.
- W4385532512 hasRelatedWork W2114013244 @default.
- W4385532512 hasRelatedWork W2325015278 @default.
- W4385532512 hasRelatedWork W2786165659 @default.
- W4385532512 hasRelatedWork W2919565175 @default.
- W4385532512 hasRelatedWork W4385532512 @default.
- W4385532512 isParatext "false" @default.
- W4385532512 isRetracted "false" @default.
- W4385532512 workType "article" @default.