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- W4385800897 abstract "We present a III-V/SOI platform using wafer-bonding which allows integration of lasers. We demonstrated new lasers leveraging innovations this platform provides: nanosecond wavelength tuning laser, 10GHz-frequency continuous tuning DFB laser and a new few mode-locking laser." @default.
- W4385800897 created "2023-08-15" @default.
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- W4385800897 date "2023-07-02" @default.
- W4385800897 modified "2023-10-18" @default.
- W4385800897 title "III-V/SOI as a versatile platform for innovative hybrid lasers: from fast tunable lasers to multimode DFB comb-source lasers" @default.
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- W4385800897 doi "https://doi.org/10.1109/oecc56963.2023.10209782" @default.
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