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- W4386291292 abstract "Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process." @default.
- W4386291292 created "2023-08-31" @default.
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- W4386291292 date "2023-06-01" @default.
- W4386291292 modified "2023-10-01" @default.
- W4386291292 title "75‐2: Failure Mechanisms and Optimum Methods for Through Glass Via" @default.
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- W4386291292 doi "https://doi.org/10.1002/sdtp.16753" @default.
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