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• W4386410903 abstract "Significantly improving the balance between the mechanical strength and electrical conductivity of solid-solution copper alloys is considered difficult. In this study, a comprehensive elemental screening framework is proposed to predict the solid-solution strengthening and electrical resistivity of copper alloys. Electrical resistivities are predicted by first-principles calculations, and a high degree of accuracy is obtained. Two models are considered to predict the solid-solution strengthening. One of them uses the generalized critical resolved shear stress formula and provides a reasonable accuracy for a testing set of our experimental data. The other model (using the first model as a feature with elemental features) has a high prediction performance for the testing set. Combining the predicted electrical resistivity and solid-solution strengthening, we establish a figure-of-merit formula for the comprehensive elemental screening. The formula provides reasonable results using the two models. The models predicted the known Cu – Ag (Cd, In, Mg) as high-performance copper alloys. All solute elements, H to Rn, including hypothetical copper alloys are ranked, and the less studied Cu – Au, –Hg, and – Tl are predicted to be high-performance structures. From economic, environmental, and healthcare perspectives, Cu – Mg is an appropriate choice according to the results." @default.
• W4386410903 created "2023-09-05" @default.
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• W4386410903 date "2023-09-04" @default.
• W4386410903 modified "2023-10-01" @default.
• W4386410903 title "Comprehensive elemental screening of solid-solution copper alloys" @default.
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• W4386410903 doi "https://doi.org/10.1080/27660400.2023.2250704" @default.
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