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- W4386859046 abstract "The integrity of bond pad Aluminum(Al) thickness is essential in silicon wafer processing. The extensive usage of electronic devices in automotive applications suggests that high reliability and long life are required. Therefore, the reliability of copper ball onto aluminum bond pad depends on the aluminum remnant and Cu-Al intermetallic formation. An assessment will be done between (3D) Laser Scanning Microscope versus conventional cross-sectioning used to measure the Aluminum remnant thickness on base bond pad. These two measurements will be compared with PFIB-Plasma Focused Ion Beam in terms of measurement accuracy and total turn-around time (TAT) taken to perform sample preparation and measurement. For 3D Laser Scanning Microscope, a comparison was done between centralized and average measurement method to derive the imprint base bond pad thickness. The centralized method measurement with fitted imprint ball bond automatically detects the center homogenous surface whereas for average method, the measurement automatically detects at edge non-homogenous surface of imprint bond pad which results in higher thickness measurement. Centralized method using fitted ball imprint area measured with 3D Laser Scanning Microscope showed comparable measurement results or near perfect measurement with reference to cross section & PFIB measurement for Aluminium remnant thickness. 3D Laser Scanning Microscope has a better edge than conventional cross-sectioning for measurement of base bond pad aluminum remnant thickness. In the future, a 3D Laser Scanning Microscope will be used as a standard tool/technique for aluminum remnant thickness measurement as it significantly improves TAT> 90%-time reduction compared to the conventional method using cross-sectioning." @default.
- W4386859046 created "2023-09-20" @default.
- W4386859046 creator A5022631250 @default.
- W4386859046 creator A5040464554 @default.
- W4386859046 creator A5058902918 @default.
- W4386859046 creator A5068963200 @default.
- W4386859046 creator A5092901717 @default.
- W4386859046 date "2023-07-24" @default.
- W4386859046 modified "2023-09-27" @default.
- W4386859046 title "Measurement of Aluminium Remnant Thickness on Copper Wire Bonding using 3D Laser Scanning Microscope" @default.
- W4386859046 cites W2165484022 @default.
- W4386859046 doi "https://doi.org/10.1109/ipfa58228.2023.10249045" @default.
- W4386859046 hasPublicationYear "2023" @default.
- W4386859046 type Work @default.
- W4386859046 citedByCount "0" @default.
- W4386859046 crossrefType "proceedings-article" @default.
- W4386859046 hasAuthorship W4386859046A5022631250 @default.
- W4386859046 hasAuthorship W4386859046A5040464554 @default.
- W4386859046 hasAuthorship W4386859046A5058902918 @default.
- W4386859046 hasAuthorship W4386859046A5068963200 @default.
- W4386859046 hasAuthorship W4386859046A5092901717 @default.
- W4386859046 hasConcept C120665830 @default.
- W4386859046 hasConcept C121332964 @default.
- W4386859046 hasConcept C141349535 @default.
- W4386859046 hasConcept C147080431 @default.
- W4386859046 hasConcept C159985019 @default.
- W4386859046 hasConcept C192562407 @default.
- W4386859046 hasConcept C26771246 @default.
- W4386859046 hasConcept C2778759172 @default.
- W4386859046 hasConcept C2781117724 @default.
- W4386859046 hasConcept C513153333 @default.
- W4386859046 hasConcept C520434653 @default.
- W4386859046 hasConcept C67649825 @default.
- W4386859046 hasConcept C77017923 @default.
- W4386859046 hasConceptScore W4386859046C120665830 @default.
- W4386859046 hasConceptScore W4386859046C121332964 @default.
- W4386859046 hasConceptScore W4386859046C141349535 @default.
- W4386859046 hasConceptScore W4386859046C147080431 @default.
- W4386859046 hasConceptScore W4386859046C159985019 @default.
- W4386859046 hasConceptScore W4386859046C192562407 @default.
- W4386859046 hasConceptScore W4386859046C26771246 @default.
- W4386859046 hasConceptScore W4386859046C2778759172 @default.
- W4386859046 hasConceptScore W4386859046C2781117724 @default.
- W4386859046 hasConceptScore W4386859046C513153333 @default.
- W4386859046 hasConceptScore W4386859046C520434653 @default.
- W4386859046 hasConceptScore W4386859046C67649825 @default.
- W4386859046 hasConceptScore W4386859046C77017923 @default.
- W4386859046 hasLocation W43868590461 @default.
- W4386859046 hasOpenAccess W4386859046 @default.
- W4386859046 hasPrimaryLocation W43868590461 @default.
- W4386859046 hasRelatedWork W119975033 @default.
- W4386859046 hasRelatedWork W1532628279 @default.
- W4386859046 hasRelatedWork W1991456456 @default.
- W4386859046 hasRelatedWork W2006802527 @default.
- W4386859046 hasRelatedWork W2288792555 @default.
- W4386859046 hasRelatedWork W2391885319 @default.
- W4386859046 hasRelatedWork W2403466521 @default.
- W4386859046 hasRelatedWork W4234565571 @default.
- W4386859046 hasRelatedWork W4309287869 @default.
- W4386859046 hasRelatedWork W8856992 @default.
- W4386859046 isParatext "false" @default.
- W4386859046 isRetracted "false" @default.
- W4386859046 workType "article" @default.