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- W4386859217 abstract "Focused Ion Beam (FIB) is one the most common use semiconductor analytic tool nowadays. FIB main function includes small area cross section analysis, TEM lamella sample preparation and die level circuit edit. Die level circuit edit using combination of circuit study and both etching & deposition method is important. This approach enables direct accessibility to suspected failure circuit by using micro-probe pad. A method to perform in depth fault isolation using FIB edit and microprobing method that will be presented in this paper." @default.
- W4386859217 created "2023-09-20" @default.
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- W4386859217 date "2023-07-24" @default.
- W4386859217 modified "2023-09-27" @default.
- W4386859217 title "In Depth Fault Isolation Using FIB Edit & Micro-probing Method" @default.
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- W4386859217 doi "https://doi.org/10.1109/ipfa58228.2023.10249108" @default.
- W4386859217 hasPublicationYear "2023" @default.
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