Matches in SemOpenAlex for { <https://semopenalex.org/work/W4387187382> ?p ?o ?g. }
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- W4387187382 endingPage "263" @default.
- W4387187382 startingPage "247" @default.
- W4387187382 abstract "An overview of various low temperature (<200°C) wafer bonding processes using metal interlayers is presented. Such processes are very attractive for novel applications in 3D heterogenous packaging as the allow for simultaneous formation of electrical interconnects, as well as hermetic encapsulation of various sensors and microelectromechanical systems-based devices. Metal wafer bonding is a generic category of processes consisting of various sub-categories, each one defined by the different principles governing the process. One can differentiate between eutectic wafer bonding (a eutectic alloy is formed as bonding layer during the process by liquid-solid interdiffusion), intermetallic wafer bonding (an intermetallic alloy is formed as bonding layer during the process by solid-liquid interdiffusion, process known also as Solid Liquid Intermetallic Diffusion – SLID or Transient Liquid Phase – TLP), and metal thermo-compression (TC) wafer bonding. Different critical/gating parameters were investigated and their impact for generally reducing processing temperatures for the different metal bonding systems was studied." @default.
- W4387187382 created "2023-09-30" @default.
- W4387187382 creator A5002341135 @default.
- W4387187382 creator A5015913842 @default.
- W4387187382 creator A5019854759 @default.
- W4387187382 creator A5024253162 @default.
- W4387187382 creator A5027771430 @default.
- W4387187382 creator A5032387862 @default.
- W4387187382 creator A5032444203 @default.
- W4387187382 creator A5040118977 @default.
- W4387187382 creator A5052876062 @default.
- W4387187382 creator A5055531903 @default.
- W4387187382 creator A5070372179 @default.
- W4387187382 creator A5082029318 @default.
- W4387187382 creator A5090054613 @default.
- W4387187382 creator A5092969085 @default.
- W4387187382 date "2023-09-29" @default.
- W4387187382 modified "2023-09-30" @default.
- W4387187382 title "Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration" @default.
- W4387187382 doi "https://doi.org/10.1149/11203.0247ecst" @default.
- W4387187382 hasPublicationYear "2023" @default.
- W4387187382 type Work @default.
- W4387187382 citedByCount "0" @default.
- W4387187382 crossrefType "journal-article" @default.
- W4387187382 hasAuthorship W4387187382A5002341135 @default.
- W4387187382 hasAuthorship W4387187382A5015913842 @default.
- W4387187382 hasAuthorship W4387187382A5019854759 @default.
- W4387187382 hasAuthorship W4387187382A5024253162 @default.
- W4387187382 hasAuthorship W4387187382A5027771430 @default.
- W4387187382 hasAuthorship W4387187382A5032387862 @default.
- W4387187382 hasAuthorship W4387187382A5032444203 @default.
- W4387187382 hasAuthorship W4387187382A5040118977 @default.
- W4387187382 hasAuthorship W4387187382A5052876062 @default.
- W4387187382 hasAuthorship W4387187382A5055531903 @default.
- W4387187382 hasAuthorship W4387187382A5070372179 @default.
- W4387187382 hasAuthorship W4387187382A5082029318 @default.
- W4387187382 hasAuthorship W4387187382A5090054613 @default.
- W4387187382 hasAuthorship W4387187382A5092969085 @default.
- W4387187382 hasConcept C119599485 @default.
- W4387187382 hasConcept C127413603 @default.
- W4387187382 hasConcept C140269135 @default.
- W4387187382 hasConcept C159985019 @default.
- W4387187382 hasConcept C160671074 @default.
- W4387187382 hasConcept C165005293 @default.
- W4387187382 hasConcept C18168003 @default.
- W4387187382 hasConcept C191897082 @default.
- W4387187382 hasConcept C192562407 @default.
- W4387187382 hasConcept C201414436 @default.
- W4387187382 hasConcept C201845621 @default.
- W4387187382 hasConcept C27501479 @default.
- W4387187382 hasConcept C2778492893 @default.
- W4387187382 hasConcept C2779133538 @default.
- W4387187382 hasConcept C2779227376 @default.
- W4387187382 hasConcept C2780026712 @default.
- W4387187382 hasConcept C37487178 @default.
- W4387187382 hasConcept C37977207 @default.
- W4387187382 hasConcept C49040817 @default.
- W4387187382 hasConceptScore W4387187382C119599485 @default.
- W4387187382 hasConceptScore W4387187382C127413603 @default.
- W4387187382 hasConceptScore W4387187382C140269135 @default.
- W4387187382 hasConceptScore W4387187382C159985019 @default.
- W4387187382 hasConceptScore W4387187382C160671074 @default.
- W4387187382 hasConceptScore W4387187382C165005293 @default.
- W4387187382 hasConceptScore W4387187382C18168003 @default.
- W4387187382 hasConceptScore W4387187382C191897082 @default.
- W4387187382 hasConceptScore W4387187382C192562407 @default.
- W4387187382 hasConceptScore W4387187382C201414436 @default.
- W4387187382 hasConceptScore W4387187382C201845621 @default.
- W4387187382 hasConceptScore W4387187382C27501479 @default.
- W4387187382 hasConceptScore W4387187382C2778492893 @default.
- W4387187382 hasConceptScore W4387187382C2779133538 @default.
- W4387187382 hasConceptScore W4387187382C2779227376 @default.
- W4387187382 hasConceptScore W4387187382C2780026712 @default.
- W4387187382 hasConceptScore W4387187382C37487178 @default.
- W4387187382 hasConceptScore W4387187382C37977207 @default.
- W4387187382 hasConceptScore W4387187382C49040817 @default.
- W4387187382 hasIssue "3" @default.
- W4387187382 hasLocation W43871873821 @default.
- W4387187382 hasOpenAccess W4387187382 @default.
- W4387187382 hasPrimaryLocation W43871873821 @default.
- W4387187382 hasRelatedWork W2001354935 @default.
- W4387187382 hasRelatedWork W2007557890 @default.
- W4387187382 hasRelatedWork W2028462573 @default.
- W4387187382 hasRelatedWork W2055527389 @default.
- W4387187382 hasRelatedWork W2291092321 @default.
- W4387187382 hasRelatedWork W2373435326 @default.
- W4387187382 hasRelatedWork W2615030411 @default.
- W4387187382 hasRelatedWork W2615447987 @default.
- W4387187382 hasRelatedWork W2793010763 @default.
- W4387187382 hasRelatedWork W4387187382 @default.
- W4387187382 hasVolume "112" @default.
- W4387187382 isParatext "false" @default.
- W4387187382 isRetracted "false" @default.
- W4387187382 workType "article" @default.