Matches in SemOpenAlex for { <https://semopenalex.org/work/W4387207315> ?p ?o ?g. }
Showing items 1 to 89 of
89
with 100 items per page.
- W4387207315 endingPage "115233" @default.
- W4387207315 startingPage "115233" @default.
- W4387207315 abstract "Epoxy mold compounds (EMCs) with thermal conductivity of 0.8–4 W/m∙K and a glass transition temperature (Tg) of 150–270 °C were prepared using epoxy resins with various network structures and SiO2 and Al2O3 fillers. The test structure was fabricated using a heat-generating test element group (TEG) chip and an EMC in which the thermal conductivity and Tg varied. The TEG chip has two types of measurement pad: one for sensing the surface temperature and the other for heating the chip surface. The thermal resistance of the package structure model decreased from 14 °C/W to 4 °C/W from 0.8 to 4 W/m∙K, with the thermal conductivity of the mold compound having the same Tg. The thermal resistance of the package structure model decreased from 7.5 °C/W to 5.5 °C/W by increasing the Tg of the mold compound having the same thermal conductivity from 150 °C to 270 °C. Control over the thermal conductivity of the EMCs appeared to have a greater effect than the Tg on the thermal resistance of the package structure model using a TEG. The liquid EMC with a thermal conductivity of 4 W/m∙K provided the lowest thermal resistance (4 °C/W) among the EMCs examined." @default.
- W4387207315 created "2023-09-30" @default.
- W4387207315 creator A5003122353 @default.
- W4387207315 creator A5049835634 @default.
- W4387207315 creator A5072065986 @default.
- W4387207315 date "2023-12-01" @default.
- W4387207315 modified "2023-10-14" @default.
- W4387207315 title "Obtaining thermal resistance of mold compounds using a package structure model with a heat-generating test element group: Comparison of the thermal conductivity and glass transition temperature of epoxy mold compounds" @default.
- W4387207315 cites W1964542241 @default.
- W4387207315 cites W1982193100 @default.
- W4387207315 cites W1989950587 @default.
- W4387207315 cites W1992505139 @default.
- W4387207315 cites W2003434581 @default.
- W4387207315 cites W2014131010 @default.
- W4387207315 cites W2017752190 @default.
- W4387207315 cites W2060326546 @default.
- W4387207315 cites W2077188935 @default.
- W4387207315 cites W2136950565 @default.
- W4387207315 cites W2158139941 @default.
- W4387207315 cites W2389816682 @default.
- W4387207315 cites W2801687626 @default.
- W4387207315 cites W2891890676 @default.
- W4387207315 cites W2994834263 @default.
- W4387207315 cites W3002578446 @default.
- W4387207315 cites W3048449103 @default.
- W4387207315 cites W3075325345 @default.
- W4387207315 cites W3093584293 @default.
- W4387207315 cites W3114428776 @default.
- W4387207315 cites W3137213252 @default.
- W4387207315 cites W3167429085 @default.
- W4387207315 cites W3205724606 @default.
- W4387207315 cites W3206054910 @default.
- W4387207315 cites W3206982956 @default.
- W4387207315 cites W4213136060 @default.
- W4387207315 cites W4223537139 @default.
- W4387207315 cites W4240822711 @default.
- W4387207315 doi "https://doi.org/10.1016/j.microrel.2023.115233" @default.
- W4387207315 hasPublicationYear "2023" @default.
- W4387207315 type Work @default.
- W4387207315 citedByCount "0" @default.
- W4387207315 crossrefType "journal-article" @default.
- W4387207315 hasAuthorship W4387207315A5003122353 @default.
- W4387207315 hasAuthorship W4387207315A5049835634 @default.
- W4387207315 hasAuthorship W4387207315A5072065986 @default.
- W4387207315 hasConcept C102232406 @default.
- W4387207315 hasConcept C121332964 @default.
- W4387207315 hasConcept C122865956 @default.
- W4387207315 hasConcept C129446986 @default.
- W4387207315 hasConcept C137693562 @default.
- W4387207315 hasConcept C159985019 @default.
- W4387207315 hasConcept C166595027 @default.
- W4387207315 hasConcept C192562407 @default.
- W4387207315 hasConcept C204530211 @default.
- W4387207315 hasConcept C2780566776 @default.
- W4387207315 hasConcept C521977710 @default.
- W4387207315 hasConcept C97346530 @default.
- W4387207315 hasConcept C97355855 @default.
- W4387207315 hasConceptScore W4387207315C102232406 @default.
- W4387207315 hasConceptScore W4387207315C121332964 @default.
- W4387207315 hasConceptScore W4387207315C122865956 @default.
- W4387207315 hasConceptScore W4387207315C129446986 @default.
- W4387207315 hasConceptScore W4387207315C137693562 @default.
- W4387207315 hasConceptScore W4387207315C159985019 @default.
- W4387207315 hasConceptScore W4387207315C166595027 @default.
- W4387207315 hasConceptScore W4387207315C192562407 @default.
- W4387207315 hasConceptScore W4387207315C204530211 @default.
- W4387207315 hasConceptScore W4387207315C2780566776 @default.
- W4387207315 hasConceptScore W4387207315C521977710 @default.
- W4387207315 hasConceptScore W4387207315C97346530 @default.
- W4387207315 hasConceptScore W4387207315C97355855 @default.
- W4387207315 hasLocation W43872073151 @default.
- W4387207315 hasOpenAccess W4387207315 @default.
- W4387207315 hasPrimaryLocation W43872073151 @default.
- W4387207315 hasRelatedWork W1972396310 @default.
- W4387207315 hasRelatedWork W1995958177 @default.
- W4387207315 hasRelatedWork W2059475353 @default.
- W4387207315 hasRelatedWork W2096807259 @default.
- W4387207315 hasRelatedWork W2135932367 @default.
- W4387207315 hasRelatedWork W2593200884 @default.
- W4387207315 hasRelatedWork W2730458908 @default.
- W4387207315 hasRelatedWork W2903034782 @default.
- W4387207315 hasRelatedWork W4387207315 @default.
- W4387207315 hasRelatedWork W1652991302 @default.
- W4387207315 hasVolume "151" @default.
- W4387207315 isParatext "false" @default.
- W4387207315 isRetracted "false" @default.
- W4387207315 workType "article" @default.