Matches in SemOpenAlex for { <https://semopenalex.org/work/W4387207385> ?p ?o ?g. }
Showing items 1 to 95 of
95
with 100 items per page.
- W4387207385 endingPage "115240" @default.
- W4387207385 startingPage "115240" @default.
- W4387207385 abstract "Circuit Under Pad (CUP), also known as Bond Pad Over Active (BPOA), has been gaining popularity in the semiconductor industry. However, such a design concept amplifies the effect of stress-inducing processes, which are detrimental to the chip's electrical performance and mechanical reliability. The said processes are wire bonding and wafer probing, and they are unavoidable in the manufacturing of a semiconductor. Although the Finite Element Analysis (FEA) of these processes has been carried out in previous research, the focus was not on the polysilicon resistor or metallization layers in CUP, but on the bond pad only. On the other hand, wire bonding is carried out after wafer probing in the manufacturing line. However previous studies, either numerically or experimentally, investigated the processes separately. Specifically, those studies did not link the stress and deformation history of the wafer-CUP structure resulting from the wafer probing to the stress and deformation induced in the subsequent wire bonding process. Therefore, this project scoped both simulations in a continuous manner and using a CUP design as the chip's structure. ANSYS Mechanical was utilized to simulate the dynamic wafer probing and thermosonic wire bonding. The result showed that copper bonding exerted more stress compared to gold bonding. Meanwhile, the Cu/low-k chip is more sensitive to stress-inducing factors than the Al/SiO2 chip." @default.
- W4387207385 created "2023-09-30" @default.
- W4387207385 creator A5001054617 @default.
- W4387207385 creator A5005855098 @default.
- W4387207385 creator A5032022622 @default.
- W4387207385 creator A5073481748 @default.
- W4387207385 creator A5074127978 @default.
- W4387207385 date "2023-12-01" @default.
- W4387207385 modified "2023-10-14" @default.
- W4387207385 title "Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad" @default.
- W4387207385 cites W1966815625 @default.
- W4387207385 cites W1980365860 @default.
- W4387207385 cites W1991283598 @default.
- W4387207385 cites W2009000347 @default.
- W4387207385 cites W2037900374 @default.
- W4387207385 cites W2080377185 @default.
- W4387207385 cites W2082309610 @default.
- W4387207385 cites W2102464802 @default.
- W4387207385 cites W2106636144 @default.
- W4387207385 cites W2133489302 @default.
- W4387207385 cites W2165391385 @default.
- W4387207385 cites W2166396168 @default.
- W4387207385 cites W2461436842 @default.
- W4387207385 cites W2619924500 @default.
- W4387207385 cites W2975136216 @default.
- W4387207385 cites W3049375913 @default.
- W4387207385 cites W3186851529 @default.
- W4387207385 cites W4292680263 @default.
- W4387207385 cites W4312469690 @default.
- W4387207385 doi "https://doi.org/10.1016/j.microrel.2023.115240" @default.
- W4387207385 hasPublicationYear "2023" @default.
- W4387207385 type Work @default.
- W4387207385 citedByCount "0" @default.
- W4387207385 crossrefType "journal-article" @default.
- W4387207385 hasAuthorship W4387207385A5001054617 @default.
- W4387207385 hasAuthorship W4387207385A5005855098 @default.
- W4387207385 hasAuthorship W4387207385A5032022622 @default.
- W4387207385 hasAuthorship W4387207385A5073481748 @default.
- W4387207385 hasAuthorship W4387207385A5074127978 @default.
- W4387207385 hasBestOaLocation W43872073851 @default.
- W4387207385 hasConcept C119599485 @default.
- W4387207385 hasConcept C127413603 @default.
- W4387207385 hasConcept C135628077 @default.
- W4387207385 hasConcept C138885662 @default.
- W4387207385 hasConcept C140269135 @default.
- W4387207385 hasConcept C159985019 @default.
- W4387207385 hasConcept C160671074 @default.
- W4387207385 hasConcept C165005293 @default.
- W4387207385 hasConcept C192562407 @default.
- W4387207385 hasConcept C204366326 @default.
- W4387207385 hasConcept C21036866 @default.
- W4387207385 hasConcept C24326235 @default.
- W4387207385 hasConcept C2779133538 @default.
- W4387207385 hasConcept C41895202 @default.
- W4387207385 hasConcept C49040817 @default.
- W4387207385 hasConcept C66018809 @default.
- W4387207385 hasConcept C66938386 @default.
- W4387207385 hasConcept C78519656 @default.
- W4387207385 hasConceptScore W4387207385C119599485 @default.
- W4387207385 hasConceptScore W4387207385C127413603 @default.
- W4387207385 hasConceptScore W4387207385C135628077 @default.
- W4387207385 hasConceptScore W4387207385C138885662 @default.
- W4387207385 hasConceptScore W4387207385C140269135 @default.
- W4387207385 hasConceptScore W4387207385C159985019 @default.
- W4387207385 hasConceptScore W4387207385C160671074 @default.
- W4387207385 hasConceptScore W4387207385C165005293 @default.
- W4387207385 hasConceptScore W4387207385C192562407 @default.
- W4387207385 hasConceptScore W4387207385C204366326 @default.
- W4387207385 hasConceptScore W4387207385C21036866 @default.
- W4387207385 hasConceptScore W4387207385C24326235 @default.
- W4387207385 hasConceptScore W4387207385C2779133538 @default.
- W4387207385 hasConceptScore W4387207385C41895202 @default.
- W4387207385 hasConceptScore W4387207385C49040817 @default.
- W4387207385 hasConceptScore W4387207385C66018809 @default.
- W4387207385 hasConceptScore W4387207385C66938386 @default.
- W4387207385 hasConceptScore W4387207385C78519656 @default.
- W4387207385 hasLocation W43872073851 @default.
- W4387207385 hasOpenAccess W4387207385 @default.
- W4387207385 hasPrimaryLocation W43872073851 @default.
- W4387207385 hasRelatedWork W1524380114 @default.
- W4387207385 hasRelatedWork W1973473696 @default.
- W4387207385 hasRelatedWork W1991259018 @default.
- W4387207385 hasRelatedWork W1997984059 @default.
- W4387207385 hasRelatedWork W2052461205 @default.
- W4387207385 hasRelatedWork W2127455146 @default.
- W4387207385 hasRelatedWork W2153160607 @default.
- W4387207385 hasRelatedWork W2160913304 @default.
- W4387207385 hasRelatedWork W2400153779 @default.
- W4387207385 hasRelatedWork W4308123927 @default.
- W4387207385 hasVolume "151" @default.
- W4387207385 isParatext "false" @default.
- W4387207385 isRetracted "false" @default.
- W4387207385 workType "article" @default.