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- W4387329205 abstract "Covalent adaptable networks (CANs) that are cross-linked by reversible dynamic bonds have been widely investigated, aiming at making the permanently cross-linked thermosets degradable and recyclable from the awareness of economic and environmental aspects. However, it is still a great challenge to make rigid thermosets like epoxy degradable upon programmed or coded stimuli, which will highly improve the combination of the degradable properties and stability. Herein, coded interlocked covalent adaptable networks (ICANs) in rigid epoxy were cross-linked by two distinct dynamic bonds of cation−π interactions and aromatic disulfide bonds in parallel connection, which exhibited high performance and coded or programmed degradation behavior. The coded ICANs were prepared by one-pot reactions from epoxy monomers and two curing agents that contained different dynamic bonds of cation−π interactions and aromatic disulfide bonds. The coded ICANs exhibited excellent mechanical properties and outstanding solvent resistance compared to the reference CANs or noncovalent adaptable networks (NCANs) relying on single dynamic bonds. Moreover, the coded ICANs exhibited unique programmed degradation behaviors, which could only be degraded after sequential exposure to two different chemical stimuli. Unlike the normal ICANs that could be degraded by two stimuli in any sequence, the coded ICANs were insoluble when the two stimuli were applied in the wrong sequence. The coded ICANs of epoxy provided a way to construct degradable CANs with more stable networks, while this concept and function might be applicable in other skeletons, leading to other types of highly coded ICANs with high performance and controlled degradation properties." @default.
- W4387329205 created "2023-10-05" @default.
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- W4387329205 date "2023-10-04" @default.
- W4387329205 modified "2023-10-15" @default.
- W4387329205 title "Coded Interlocked Covalent Adaptable Networks Enabled by Parallel Connections of Cation−π Interactions and Aromatic Disulfide Bonds in Epoxy" @default.
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- W4387329205 doi "https://doi.org/10.1021/acsapm.3c01560" @default.
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