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- W4387400476 abstract "Influence of medium pH value and passivator concentrations on the copper passivation and CMP process were studied by electrochemical measurement technologies, relations of the film thickness and tightness with polishing process and polishing rates were investigated. Electrochemical variables influencing polishing process and rates were found out. Electochemical mechanism of polishing processes were explained by corrosion potential and corrosion current density. A recipe of K 3 as passivator and nano sized γ Al 2O 3 as abrasives in medium of NH 3·H 2O solution was confirmed reasonable. It is shown that the conditions of polishing process to be controlled are 10 psi and 300 r/min." @default.
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- W4387400476 date "2001-11-28" @default.
- W4387400476 modified "2023-10-07" @default.
- W4387400476 title "Study on Electrochemical Behavior of Copper in NH_3·H_2O Solution Medium Including K_3 during CMP" @default.
- W4387400476 doi "https://doi.org/10.61558/2993-074x.3271" @default.
- W4387400476 hasPublicationYear "2001" @default.
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