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- W4387606614 abstract "In this chapter, as a specific example, a small and thin BGA-type semiconductor package, such as CSP-μBGA (Chip Scale Package-μBall Grid Array), which is widely used as a semiconductor package, is examined from the viewpoint of its constituent materials, structure, and thermal process. The cross-sectional structure of the CSP-μBGA is shown. This CSP-μBGA has a structure in which a soft elastomer is interposed between the LSI chip and the TAB tape to buffer the thermal stress. In addition, the ends of the TAB tape and Cu lead are sealed using a filler-filled epoxy resin. Therefore, Visco-Elastic Stress Analysis Program (VESAP) analysis was performed to predict the thermal stress and warpage deformation behavior of this CSP-μBGA. The chapter shows the thermal and mechanical properties of the various materials that make up the laminate." @default.
- W4387606614 created "2023-10-14" @default.
- W4387606614 date "2023-08-31" @default.
- W4387606614 modified "2023-10-14" @default.
- W4387606614 title "Application to CSP‐μBGA" @default.
- W4387606614 doi "https://doi.org/10.1002/9781394188826.ch9" @default.
- W4387606614 hasPublicationYear "2023" @default.
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