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- W4387675685 abstract "A low-temperature brazing method of diamond and Cu was proposed by using composite filler of Au-Si eutectic + NiTi particle. Prior to joining, diamond surface was modified by an active alloy of AgCu28+TiH2, the resulting Ag-Cu coating could ensure the good wettability of Au-Si filler during brazing and formed TiC layer could ensure a tight interfacial bonding. In the brazing process, it was found that melting point depressant element of Si in Au-Si filler could be completely consumed by (i) reacted with NiTi alloy and formed NiTiSi whiskers and (ii) precipitation in form of Ti5Si3C and TiCuSi in modified layer, while the interdiffusion between Au and Cu substrate lead to a ductile seam matrix of heat-resistant (Au, Cu)ss. Attributed to the excellent plasticity and high melting temperature of (Au, Cu)ss and the strengthening effect of NiTiSi whiskers, the joint brazed at 600 ℃ not only have a high shear strength of 108 MPa at room temperature, but also exhibited a excellent heat-resistance, the joint showed a shear strength of 89 MPa and 28 MPa at 300 ℃ and 500 ℃, respectively." @default.
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- W4387675685 date "2023-10-01" @default.
- W4387675685 modified "2023-10-17" @default.
- W4387675685 title "A new low-temperature preparation technology of heat-resistant diamond/Cu joint using composite braze: microstructure evolution and mechanical properties strengthening" @default.
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- W4387675685 doi "https://doi.org/10.1016/j.jmatprotec.2023.118194" @default.
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