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- W48941324 endingPage "36" @default.
- W48941324 startingPage "28" @default.
- W48941324 abstract "To examine the ultrastructure of bonding to occlusal enamel fissures using phosphoric acid etching in combination with a pit and fissure sealant (Clinpro Sealant), a total-etch single-bottle adhesive (One-Step) followed by the fissure sealant, and two single-step self-etch adhesives (Adper Prompt and Xeno III) followed by the fissure sealant.Sections of bonded enamel fissures retrieved from specimens bonded in vivo were polished, and rinsed with phosphoric acid to bring surfaces into relief. They were examined, first under non-dehydrated conditions with field emission-environmental SEM, to evaluate the marginal integrity of the bonds. The same specimens were then re-examined under dehydrated conditions with conventional SEM to capture more detailed ultrastructural features. Extent of resin penetration into etched enamel was further evaluated by TEM examination of sections taken from undemineralized unstained bonded specimens. These sections were further examined after HCl demineralization and staining.All occlusal fissure walls examined were lined with remnant aprismatic enamel. Full penetration of resins into the bottom of the fissures, and gap-free interfaces were not observed in any of the specimens, irrespective of whether total-etch or self-etch adhesives were used with the sealant. Phosphoric acid did not penetrate well into the fissures and although hybridization of the etched aprismatic enamel was observed with or without the use of the total-etch adhesive, etching was inconsistent and gaps were frequently observed. Entrapment of bacteria within the fissure walls was frequently seen. The more aggressive self-etch adhesive Adper Prompt created etching in aprismatic enamel that approached that of phosphoric acid etching. The moderately aggressive self-etch adhesive Xeno III produced 1 mm thick hybrid layers in the aprismatic enamel fissure wall." @default.
- W48941324 created "2016-06-24" @default.
- W48941324 creator A5036340283 @default.
- W48941324 creator A5061682621 @default.
- W48941324 creator A5076115296 @default.
- W48941324 creator A5079203263 @default.
- W48941324 date "2005-02-01" @default.
- W48941324 modified "2023-09-30" @default.
- W48941324 title "Pit and fissure sealing. Bonding of bulk-cured, low-filled, light-curing resins to bacteria-contaminated uncut enamel in high c-factor cavities." @default.
- W48941324 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/15810478" @default.
- W48941324 hasPublicationYear "2005" @default.
- W48941324 type Work @default.
- W48941324 sameAs 48941324 @default.
- W48941324 citedByCount "16" @default.
- W48941324 countsByYear W489413242013 @default.
- W48941324 countsByYear W489413242014 @default.
- W48941324 countsByYear W489413242015 @default.
- W48941324 countsByYear W489413242016 @default.
- W48941324 countsByYear W489413242017 @default.
- W48941324 countsByYear W489413242019 @default.
- W48941324 crossrefType "journal-article" @default.
- W48941324 hasAuthorship W48941324A5036340283 @default.
- W48941324 hasAuthorship W48941324A5061682621 @default.
- W48941324 hasAuthorship W48941324A5076115296 @default.
- W48941324 hasAuthorship W48941324A5079203263 @default.
- W48941324 hasConcept C127413603 @default.
- W48941324 hasConcept C156887251 @default.
- W48941324 hasConcept C159096172 @default.
- W48941324 hasConcept C159985019 @default.
- W48941324 hasConcept C191897082 @default.
- W48941324 hasConcept C192562407 @default.
- W48941324 hasConcept C199343813 @default.
- W48941324 hasConcept C202271784 @default.
- W48941324 hasConcept C2775883587 @default.
- W48941324 hasConcept C2776052348 @default.
- W48941324 hasConcept C2776622989 @default.
- W48941324 hasConcept C2778265030 @default.
- W48941324 hasConcept C2779227376 @default.
- W48941324 hasConcept C2780749890 @default.
- W48941324 hasConcept C42475967 @default.
- W48941324 hasConcept C68928338 @default.
- W48941324 hasConcept C71924100 @default.
- W48941324 hasConcept C80107235 @default.
- W48941324 hasConceptScore W48941324C127413603 @default.
- W48941324 hasConceptScore W48941324C156887251 @default.
- W48941324 hasConceptScore W48941324C159096172 @default.
- W48941324 hasConceptScore W48941324C159985019 @default.
- W48941324 hasConceptScore W48941324C191897082 @default.
- W48941324 hasConceptScore W48941324C192562407 @default.
- W48941324 hasConceptScore W48941324C199343813 @default.
- W48941324 hasConceptScore W48941324C202271784 @default.
- W48941324 hasConceptScore W48941324C2775883587 @default.
- W48941324 hasConceptScore W48941324C2776052348 @default.
- W48941324 hasConceptScore W48941324C2776622989 @default.
- W48941324 hasConceptScore W48941324C2778265030 @default.
- W48941324 hasConceptScore W48941324C2779227376 @default.
- W48941324 hasConceptScore W48941324C2780749890 @default.
- W48941324 hasConceptScore W48941324C42475967 @default.
- W48941324 hasConceptScore W48941324C68928338 @default.
- W48941324 hasConceptScore W48941324C71924100 @default.
- W48941324 hasConceptScore W48941324C80107235 @default.
- W48941324 hasIssue "1" @default.
- W48941324 hasLocation W489413241 @default.
- W48941324 hasOpenAccess W48941324 @default.
- W48941324 hasPrimaryLocation W489413241 @default.
- W48941324 hasRelatedWork W1821962932 @default.
- W48941324 hasRelatedWork W1979650898 @default.
- W48941324 hasRelatedWork W2139271805 @default.
- W48941324 hasRelatedWork W2149388159 @default.
- W48941324 hasRelatedWork W2375043416 @default.
- W48941324 hasRelatedWork W2410159621 @default.
- W48941324 hasRelatedWork W2558677018 @default.
- W48941324 hasRelatedWork W2941841458 @default.
- W48941324 hasRelatedWork W48941324 @default.
- W48941324 hasRelatedWork W99267112 @default.
- W48941324 hasVolume "18" @default.
- W48941324 isParatext "false" @default.
- W48941324 isRetracted "false" @default.
- W48941324 magId "48941324" @default.
- W48941324 workType "article" @default.