Matches in SemOpenAlex for { <https://semopenalex.org/work/W55573225> ?p ?o ?g. }
- W55573225 endingPage "16" @default.
- W55573225 startingPage "10" @default.
- W55573225 abstract "In order to construct the multi layers IVH (Interstitial Via Hole) structure with only one time hot pressing, we have developed the new diffusion bonding technology. In this paper, the sintering process of Ag-Sn mixed powders (Ag/Sn:65/35 mass%) between copper foils in IVH with hot vacuum pressing was investigated, and the effect of temperature on the respective diffusion reactions was discussed. Ag and Sn formed Ag3Sn up to 473 K with the solid diffusion reaction. At 483 K, Ag particles disappeared completely and the mixed compact consisted of Ag3Sn and excess Sn. Cu-Sn diffusion reaction between excess Sn and copper foil commenced at 493 K. Excess Sn was consumed completely below 573 K. The liquid phase of Sn contributed not only to Cu-Sn diffusion bonding but also to Ag3Sn sintering. As a result of hot pressing above 573 K, the mechanical properties were improved without large grain growth of Ag3Sn (about 4 μm)." @default.
- W55573225 created "2016-06-24" @default.
- W55573225 creator A5011417312 @default.
- W55573225 creator A5018623595 @default.
- W55573225 creator A5048698467 @default.
- W55573225 creator A5065064113 @default.
- W55573225 creator A5084812254 @default.
- W55573225 date "2010-01-01" @default.
- W55573225 modified "2023-10-04" @default.
- W55573225 title "Development of a New Multi Layer Substrate Bonding Technology using Ag-Sn Liquid Phase Sintering Process (First Report) -Investigations of Diffusion Processes-" @default.
- W55573225 doi "https://doi.org/10.2497/jjspm.57.10" @default.
- W55573225 hasPublicationYear "2010" @default.
- W55573225 type Work @default.
- W55573225 sameAs 55573225 @default.
- W55573225 citedByCount "3" @default.
- W55573225 countsByYear W555732252013 @default.
- W55573225 crossrefType "journal-article" @default.
- W55573225 hasAuthorship W55573225A5011417312 @default.
- W55573225 hasAuthorship W55573225A5018623595 @default.
- W55573225 hasAuthorship W55573225A5048698467 @default.
- W55573225 hasAuthorship W55573225A5065064113 @default.
- W55573225 hasAuthorship W55573225A5084812254 @default.
- W55573225 hasBestOaLocation W555732251 @default.
- W55573225 hasConcept C111368507 @default.
- W55573225 hasConcept C121332964 @default.
- W55573225 hasConcept C127313418 @default.
- W55573225 hasConcept C127413603 @default.
- W55573225 hasConcept C159985019 @default.
- W55573225 hasConcept C178790620 @default.
- W55573225 hasConcept C183808158 @default.
- W55573225 hasConcept C185592680 @default.
- W55573225 hasConcept C191897082 @default.
- W55573225 hasConcept C192562407 @default.
- W55573225 hasConcept C200902554 @default.
- W55573225 hasConcept C201845621 @default.
- W55573225 hasConcept C2776578615 @default.
- W55573225 hasConcept C2777289219 @default.
- W55573225 hasConcept C2777581544 @default.
- W55573225 hasConcept C2778856520 @default.
- W55573225 hasConcept C2779227376 @default.
- W55573225 hasConcept C3017618536 @default.
- W55573225 hasConcept C3020315061 @default.
- W55573225 hasConcept C41008148 @default.
- W55573225 hasConcept C42360764 @default.
- W55573225 hasConcept C44280652 @default.
- W55573225 hasConcept C47908070 @default.
- W55573225 hasConcept C544778455 @default.
- W55573225 hasConcept C56739046 @default.
- W55573225 hasConcept C68710425 @default.
- W55573225 hasConcept C69357855 @default.
- W55573225 hasConcept C7363328 @default.
- W55573225 hasConcept C8010536 @default.
- W55573225 hasConcept C87976508 @default.
- W55573225 hasConcept C93021684 @default.
- W55573225 hasConcept C97355855 @default.
- W55573225 hasConceptScore W55573225C111368507 @default.
- W55573225 hasConceptScore W55573225C121332964 @default.
- W55573225 hasConceptScore W55573225C127313418 @default.
- W55573225 hasConceptScore W55573225C127413603 @default.
- W55573225 hasConceptScore W55573225C159985019 @default.
- W55573225 hasConceptScore W55573225C178790620 @default.
- W55573225 hasConceptScore W55573225C183808158 @default.
- W55573225 hasConceptScore W55573225C185592680 @default.
- W55573225 hasConceptScore W55573225C191897082 @default.
- W55573225 hasConceptScore W55573225C192562407 @default.
- W55573225 hasConceptScore W55573225C200902554 @default.
- W55573225 hasConceptScore W55573225C201845621 @default.
- W55573225 hasConceptScore W55573225C2776578615 @default.
- W55573225 hasConceptScore W55573225C2777289219 @default.
- W55573225 hasConceptScore W55573225C2777581544 @default.
- W55573225 hasConceptScore W55573225C2778856520 @default.
- W55573225 hasConceptScore W55573225C2779227376 @default.
- W55573225 hasConceptScore W55573225C3017618536 @default.
- W55573225 hasConceptScore W55573225C3020315061 @default.
- W55573225 hasConceptScore W55573225C41008148 @default.
- W55573225 hasConceptScore W55573225C42360764 @default.
- W55573225 hasConceptScore W55573225C44280652 @default.
- W55573225 hasConceptScore W55573225C47908070 @default.
- W55573225 hasConceptScore W55573225C544778455 @default.
- W55573225 hasConceptScore W55573225C56739046 @default.
- W55573225 hasConceptScore W55573225C68710425 @default.
- W55573225 hasConceptScore W55573225C69357855 @default.
- W55573225 hasConceptScore W55573225C7363328 @default.
- W55573225 hasConceptScore W55573225C8010536 @default.
- W55573225 hasConceptScore W55573225C87976508 @default.
- W55573225 hasConceptScore W55573225C93021684 @default.
- W55573225 hasConceptScore W55573225C97355855 @default.
- W55573225 hasIssue "1" @default.
- W55573225 hasLocation W555732251 @default.
- W55573225 hasOpenAccess W55573225 @default.
- W55573225 hasPrimaryLocation W555732251 @default.
- W55573225 hasRelatedWork W1582890892 @default.
- W55573225 hasRelatedWork W1980142763 @default.
- W55573225 hasRelatedWork W2042576283 @default.
- W55573225 hasRelatedWork W2070196183 @default.
- W55573225 hasRelatedWork W2088614093 @default.
- W55573225 hasRelatedWork W2350246350 @default.
- W55573225 hasRelatedWork W2369137088 @default.