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- W56500848 abstract "Inductive coupled communication is a wireless communication technology for three-dimensionally (3D) stacked chips in a package. As discussed in a previous chapter, capacitive coupled communication (see Figure 4.1) utilizes a pair of metal electrodes which forms a capacitive-coupling channel–essentially a capacitor–as a vertical wireless data link between stacked chips. In inductive coupled communication, a pair of metal coils creates an inductive-coupling channel–essentially a transformer–between stacked chips. Both of these are pure digital circuit solutions compatible with a standard CMOS technology. The metal electrodes and/or the metal coils can be fabricated by using IC interconnections." @default.
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- W56500848 date "2010-01-01" @default.
- W56500848 modified "2023-10-03" @default.
- W56500848 title "Inductive Coupled Communications" @default.
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- W56500848 doi "https://doi.org/10.1007/978-1-4419-6588-2_4" @default.
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